Semiconductor Package Dam and Filter Structure for Gas Sensing

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Solution Overview

Problem

Semiconductor package structures face performance issues due to unwanted substances, such as water vapor and larger particles, entering the active region of sensitive devices like gas sensors, which can hinder their operation.

Innovation Solution

A semiconductor package structure is designed with a dam surrounding the active region and a filter structure on top, featuring through holes of specific sizes to allow smaller particles like gas molecules to pass while blocking larger ones, including water molecules, thereby protecting the device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the active region is exposed to the environment for sensing, then the device can detect environmental conditions, but unwanted substances can enter and adversely affect performance

Engineering Contradiction:
Improveenvironmental sensing capabilityVSAvoidperformance degradation from unwanted substances
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

A filter structure with porous material is disposed over the exposed region of the semiconductor device. The porous structure allows gas molecules to pass through for sensing while blocking larger unwanted substances like water vapor and particles, thus maintaining environmental adaptability while protecting against harmful factors

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The filter structure acts as an intermediary between the exposed active region and the environment. It mediates the interaction by selectively allowing desired gas molecules to reach the sensor while preventing unwanted substances from causing performance degradation

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a filter structure is added to block unwanted substances, then device performance is protected, but device complexity increases

Engineering Contradiction:
Improveperformance stabilityVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The protection function is segmented into a separate filter structure component that can be independently designed and integrated. This modular approach protects the active region while maintaining clear functional separation, thus improving reliability without excessively complicating the overall device architecture

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The filter structure serves multiple functions simultaneously: it blocks unwanted substances (water vapor, particles), allows gas molecules to pass for sensing, and protects the exposed region. This multi-functionality improves reliability while minimizing the addition of separate components that would increase complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents performance degradation by filtering out unwanted substances, ensuring the semiconductor device operates reliably while allowing targeted substances to reach the active region, maintaining the device's sensitivity and waterproofing.

Implementation Method 1

a filter structure disposed on the dam... featuring through holes of specific sizes to allow smaller particles like gas molecules to pass while blocking larger ones, including water molecules

Methodology Applied
Scientific EffectPhysical filtration: Filter (physical)

Data Source

PatentUS11535509B2Semiconductor package structure and method for manufacturing the same
Publication Date: 2022.12.27 ADVANCED SEMICON ENG INC
  • US11535509B2 patent drawing
  • US11535509B2 patent drawing
  • US11535509B2 patent drawing

AI summary

A semiconductor package structure includes an electronic device having a first surface and an exposed region adjacent to the first surface; a dam disposed on the first surface and surrounding the exposed region of the electronic device; and a filter structure disposed on the dam.