Semiconductor Device Dam Portion Resin Overflow Prevention
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Solution Overview
Problem
In semiconductor devices, resin used to seal connections between semiconductor components and wiring substrates can overflow and spread to the peripheral edges, leading to reliability issues due to varying component layouts and specifications.
Innovation Solution
A dam portion, such as a wall or groove, is formed on the wiring substrate near the component mounting region to prevent resin overflow, with its design varying based on the specific layout to effectively contain the resin and maintain reliability across different semiconductor device configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dam portion is formed to prevent resin overflow, then resin containment is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by forming a dam portion only in specific regions where resin overflow is most likely to occur, rather than uniformly across the entire substrate. The dam portion is strategically positioned near peripheral edges and in regions adjacent to component mounting areas, providing targeted resin containment where needed while maintaining simplicity in other areas.
Solution Approach 2:
The dam portion is segmented into multiple regions based on component layout requirements. Different dam structures (first dam portions, second dam portions, third dam portions) are created in different areas of the substrate, with varying positions and configurations tailored to specific mounting scenarios, allowing flexible adaptation without overall complexity increase.
2Adaptability or versatility
If the dam portion design is customized for various layouts, then adaptability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent creates a universal dam portion structure that can serve multiple functions across different component layouts. The same basic dam design can be applied in various positions (first dam portions near peripheral edges, second dam portions in intermediate regions, third dam portions in other areas) to accommodate different mounting configurations, reducing the need for completely custom designs for each layout scenario.
Solution Approach 2:
The dam portions are formed in advance during substrate preparation, before component mounting. This preliminary formation allows the substrate to be pre-configured with appropriate dam structures based on anticipated component layouts, simplifying the overall manufacturing process by eliminating the need for post-mounting dam creation or complex real-time adjustments.
Data Source
AI summary
A semiconductor device includes a memory component, which is a semiconductor component (a semiconductor chip or a semiconductor package), to be mounted over an upper surface of a wiring substrate. In addition, in the upper surface, a distance between the memory component and a first substrate side of the upper surface is smaller than a distance between the memory component and a second substrate side of the upper surface. In addition, in the upper surface, a dam portion is formed between the memory component and the first substrate side.