Semiconductor Damping Assembly for Vibration and Shock Protection

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Solution Overview

Problem

Semiconductor devices are susceptible to damage from vibrations, movements, and shock impulses, which can affect their mechanical stability, performance, and reliability.

Innovation Solution

A damping device is integrated into the semiconductor device, comprising a damper and a post coupled to a chip holder, which absorbs and dampens forces through deformation and deflection of mechanical deflectors to reduce stress and prevent damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a damping device is integrated into the semiconductor device, then mechanical stability and reliability are improved, but device complexity increases

Engineering Contradiction:

Improvemechanical stabilityVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The damping device is integrated with the semiconductor device by combining the post structure with the chip holder, creating a unified assembly that provides both structural support and damping functions without requiring separate independent components

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The post serves multiple functions: it provides structural support to hold the chip, acts as a damping element to absorb vibrations and shock impulses, and connects the chip holder to the substrate, thereby reducing device complexity through multi-functionality

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Strength

If the damper absorbs forces through deformation and deflection, then stress on the chip holder is reduced, but energy loss increases

Engineering Contradiction:

Improvestress resistanceVSAvoidenergy loss

Core Design Contradiction:

StrengthVSLoss of energy

Solution Approach 1:

The damping device converts harmful vibrations, movements, and shock impulses into beneficial elastic deformation and deflection of the post and chip holder, transforming mechanical energy that would cause damage into controlled elastic responses that protect the semiconductor device

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The post and chip holder are designed with inherent elastic properties that provide beforehand cushioning against incoming shock impulses and vibrations, absorbing forces through pre-configured deformation paths that reduce stress before it reaches critical components

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The damping device enhances the mechanical stability and performance of semiconductor devices by inhibiting damage and improving reliability, particularly in microelectromechanical systems (MEMS) devices.

Implementation Method 1

absorbs and dampens forces through deformation and deflection of mechanical deflectors

Methodology Applied

Scientific EffectDeformation: Deformation

Implementation Method 2

damping device... dampens forces through deformation and deflection

Methodology Applied

Scientific EffectDamping: Damping

Data Source

PatentUS20250218980A1Damping device and method of making

Publication Date: 2025.07.03 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A damping device is provided. The damping device includes a damper including a mechanical deflector. The damping device includes a post coupled to the mechanical deflector. The damping device includes a case in which the damper is disposed.