Semiconductor Equipment Data Collection Server for High-Rate Connectivity

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The existing Advanced Group Controller (AGC) system in semiconductor manufacturing has limited data collection capability, processing only 2000 pieces of data per second, and is constrained by a maximum of 32 equipment connections, leading to high data collection pressure and inefficient communication between factory and equipment.

Innovation Solution

Implementing an equipment data collection server communicatively connected to the AGC system and semiconductor processing equipment, utilizing Web Service protocol for data collection and conversion, allowing parallel data collection and reducing reliance on factory automation for data collection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the existing AGC system architecture is used with HSMS communication protocol, then equipment connectivity is maintained, but data collection capability is limited to 2000 pieces per second

Engineering Contradiction:

Improvedata collection capabilityVSAvoiddata collection rate

Core Design Contradiction:

ProductivityVSQuantity of substance

Solution Approach 1:

The patent segments the data collection function from the control system by introducing a dedicated data collection server that runs as a separate Windows service. This separates the high-volume data collection task from the control logic, allowing parallel processing and significantly increasing data collection capability beyond the 2000 pieces per second limit of the traditional AGC system.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces a data collection server as an intermediary component between the equipment and the AGC system. This server acts as a mediator that receives data from multiple sources, processes it, and forwards it to the control system, thereby enabling higher data collection rates without overwhelming the existing HSMS communication infrastructure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the AGC system connects to maximum 32 pieces of equipment, then system stability is maintained, but data collection pressure on software applications increases

Engineering Contradiction:

Improvesystem stabilityVSAvoiddata collection pressure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the data collection function from the software application layer and places it in a dedicated Windows service running on the data collection server. This extraction removes the burden of high-volume data collection from the application, reducing data collection pressure while maintaining system stability through the dedicated service architecture.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The data collection server provides self-service capabilities by automatically managing data collection, processing, and forwarding without requiring intensive software application intervention. The Windows service automatically handles data acquisition from multiple equipment connections, reducing the complexity and pressure on the control software while maintaining stable system operation.

Inventive Principle:

Principle #25Self-service

3Ease of operation

If factory automation collects data directly from equipment, then real-time control is achieved, but communication efficiency between factory and equipment deteriorates

Engineering Contradiction:

Improvecommunication efficiencyVSAvoiddata collection time

Core Design Contradiction:

Ease of operationVSLoss of time

Solution Approach 1:

The data collection server acts as an intermediary that optimizes communication between factory equipment and the control system. It efficiently collects data from multiple equipment sources using optimized protocols, processes the data, and forwards it to the AGC system, thereby improving communication efficiency and reducing data collection time compared to direct factory automation collection.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS12430354B2Data collection method, device, and system of semiconductor processing equipment

Publication Date: 2025.09.30 BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

AI summary

The present disclosure provides a data collection method, a data collection device, and a data collection system of the semiconductor processing equipment. The method includes receiving an activated data collection plan via the first communication interface, determining equipment data information to be collected in the data collection plan, sending the equipment data information to the semiconductor processing equipment via the second communication interface, and receiving equipment data corresponding to the equipment data information sent by the semiconductor processing equipment and forwarding the equipment data to the equipment control system via the first communication interface to display the equipment data.