Semiconductor Data Collection via Merged Single Connection
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Solution Overview
Problem
Existing methods for collecting diagnostic data from semiconductor equipment often result in excessive bandwidth usage and inefficient packet space utilization due to multiple connections, leading to potential communication delays and errors.
Innovation Solution
A method that selects and orders data values to be collected from semiconductor equipment, communicating them through a single connection using a data analyzer with multiple engines, which processes the data to detect faults efficiently, thereby reducing bandwidth consumption and improving processing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate connections are established between data collector and semiconductor equipment for each chamber, then data can be collected from each chamber independently, but bandwidth usage becomes excessive and packet space utilization becomes inefficient
Solution Approach 1:
The patent merges multiple separate connections into a single shared connection for data collection. Instead of establishing individual connections between the data collector and each chamber, the system uses one connection that carries data from all chambers, thereby reducing bandwidth consumption while maintaining data collection reliability through proper packet tagging and routing.
Solution Approach 2:
The single connection serves multiple functions by carrying data from multiple chambers simultaneously. The connection is designed to handle diverse data streams from different chambers using universal packet structures that include chamber identifiers, allowing one connection to perform the work of multiple connections.
2Productivity
If separate connections are established for each chamber, then data from each chamber can be processed independently, but the number of connections increases leading to excessive bandwidth usage
Solution Approach 1:
Multiple chamber data streams are merged into a single connection with distinct packet identifiers. The data collector receives all chamber data through one connection and uses the packet structure to route each data element to the appropriate processing engine, maintaining processing efficiency while reducing connection complexity.
Solution Approach 2:
The patent introduces an intermediary packet structure that mediates between multiple chambers and the data collector. Each packet includes metadata such as chamber identifiers that enable the data collector to route data to the correct processing engine without requiring separate connections, thus simplifying the system architecture.
3Ease of operation
If data values are received without a predetermined order, then data collection is simpler, but bandwidth efficiency decreases and communication delays increase
Solution Approach 1:
The system performs preliminary ordering of data values before transmission. The data collector determines a predetermined order for receiving data values from multiple chambers and communicates this ordering requirement to the semiconductor equipment in advance. This allows data to be transmitted in an optimized sequence that improves bandwidth efficiency and reduces communication delays while maintaining operational simplicity.
Data Source
AI summary
A method for collecting data from semiconductor equipment includes selecting a plurality of data values to request from semiconductor equipment and assigning each of the data values to a chamber. Each chamber is associated with an engine that processes the data values in the associated chamber to detect a fault in the semiconductor equipment. The method also includes determining an order to receive the data values from the semiconductor equipment, and, after the order for the data values is determined, communicating a setup message requesting the semiconductor equipment to communicate the data values in the predetermined order. The method further includes receiving the data values from the semiconductor equipment and providing each of the received data values to the particular engine associated with the chamber of the data value.