Semiconductor Tool Data Collection Plan With Auto Validation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor manufacturing systems require manual setup of Data Collection Plans (DCPs) for each process tool, which is time-consuming and difficult, leading to inefficiencies in data collection and potential defects in substrates.
Innovation Solution
A method and system for automatically generating a DCP for a semiconductor manufacturing system, involving initiating a connection with the system, generating tool data items, providing a graphical user interface for user input, adding configuration data to the DCP, validating the data, and executing data collection operations based on the validated plan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If manual setup of Data Collection Plans is performed for each process tool, then the DCP can be customized to match hardware variation, but the process becomes time-consuming and difficult
Solution Approach 1:
The system creates a template-based Data Collection Plan that can be copied and automatically adapted to multiple process tools. Instead of manually configuring each DCP from scratch, a master template is established once and then replicated across numerous tools, with automatic adjustment for hardware variations through parameter mapping and system integration.
Solution Approach 2:
The system performs preliminary configuration by pre-defining data collection parameters, sensor mappings, and measurement protocols in a standardized template before deployment. This advance preparation allows rapid instantiation of tool-specific DCPs without requiring manual setup time for each individual tool.
2Reliability
If highly-skilled workers manually setup DCP for each process tool, then the configuration can be optimized, but the process becomes difficult and time-consuming
Solution Approach 1:
The system enables automatic self-configuration of Data Collection Plans by integrating with process tool hardware inventories and specifications. The system automatically maps sensors, defines measurement parameters, and configures data collection settings based on tool identification, eliminating the need for manual configuration by skilled workers while maintaining high configuration quality through validated templates.
Solution Approach 2:
A universal template framework is implemented that can serve multiple process tool types through parameter customization. The same core DCP template structure is adapted across different tool types by automatically adjusting parameters based on tool specifications, reducing the need for specialized manual configuration for each tool variant.
3Measurement precision
If separate DCPs are created for each process tool to match hardware variation, then measurement accuracy is improved, but the complexity of management increases
Solution Approach 1:
The system merges multiple individual DCP configurations into a centralized template management system. Instead of managing numerous separate DCP files for different tools, a single master template with parameterized configurations is maintained, which automatically generates tool-specific instances. This reduces management complexity while preserving measurement precision through consistent template application.
Solution Approach 2:
The system manages hardware variations through parameterization rather than creating structurally different DCPs for each tool. By using configurable parameters within a unified template framework, the system adapts to different hardware configurations through parameter adjustments rather than structural modifications, maintaining measurement precision while simplifying management.
Data Source
AI summary
A method includes receiving, via a graphical user interface (GUI), user input selecting one or more tool data items from the set of tool data items and adding configuration data associated with the one or more tool data items to a data collection plan. In a semiconductor manufacturing system, corresponding identification data is located that is indicative of whether a respective component of a semiconductor manufacturing system associated with respective configuration data is at least one of included in the semiconductor manufacturing system or is functional in the semiconductor manufacturing system. A subset of the configuration data for which corresponding identification data was not located removed from the data collection plan and one or more data collection operations are executed at the semiconductor manufacturing system based on the data collection plan.


