Semiconductor Tool Data Collection Plan With Auto Validation

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Solution Overview

Problem

Existing semiconductor manufacturing systems require manual setup of Data Collection Plans (DCPs) for each process tool, which is time-consuming and difficult, leading to inefficiencies in data collection and potential defects in substrates.

Innovation Solution

A method and system for automatically generating a DCP for a semiconductor manufacturing system, involving initiating a connection with the system, generating tool data items, providing a graphical user interface for user input, adding configuration data to the DCP, validating the data, and executing data collection operations based on the validated plan.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If manual setup of Data Collection Plans is performed for each process tool, then the DCP can be customized to match hardware variation, but the process becomes time-consuming and difficult

Engineering Contradiction:
Improvecustomization of DCP to match hardware variationVSAvoidtime required to set up DCP
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The system creates a template-based Data Collection Plan that can be copied and automatically adapted to multiple process tools. Instead of manually configuring each DCP from scratch, a master template is established once and then replicated across numerous tools, with automatic adjustment for hardware variations through parameter mapping and system integration.

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The system performs preliminary configuration by pre-defining data collection parameters, sensor mappings, and measurement protocols in a standardized template before deployment. This advance preparation allows rapid instantiation of tool-specific DCPs without requiring manual setup time for each individual tool.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If highly-skilled workers manually setup DCP for each process tool, then the configuration can be optimized, but the process becomes difficult and time-consuming

Engineering Contradiction:
Improvequality of DCP configurationVSAvoiddifficulty of setting up DCP
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The system enables automatic self-configuration of Data Collection Plans by integrating with process tool hardware inventories and specifications. The system automatically maps sensors, defines measurement parameters, and configures data collection settings based on tool identification, eliminating the need for manual configuration by skilled workers while maintaining high configuration quality through validated templates.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

A universal template framework is implemented that can serve multiple process tool types through parameter customization. The same core DCP template structure is adapted across different tool types by automatically adjusting parameters based on tool specifications, reducing the need for specialized manual configuration for each tool variant.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Measurement precision

If separate DCPs are created for each process tool to match hardware variation, then measurement accuracy is improved, but the complexity of management increases

Engineering Contradiction:
Improveaccuracy of tool sensor data collectionVSAvoidnumber of separate DCPs to manage
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The system merges multiple individual DCP configurations into a centralized template management system. Instead of managing numerous separate DCP files for different tools, a single master template with parameterized configurations is maintained, which automatically generates tool-specific instances. This reduces management complexity while preserving measurement precision through consistent template application.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The system manages hardware variations through parameterization rather than creating structurally different DCPs for each tool. By using configurable parameters within a unified template framework, the system adapts to different hardware configurations through parameter adjustments rather than structural modifications, maintaining measurement precision while simplifying management.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20250181049A1Methods and mechanisms for generating a data collection plan for a semiconductor manufacturing system
Publication Date: 2025.06.05 APPLIED MATERIALS INC
  • US20250181049A1 patent drawing
  • US20250181049A1 patent drawing
  • US20250181049A1 patent drawing

AI summary

A method includes receiving, via a graphical user interface (GUI), user input selecting one or more tool data items from the set of tool data items and adding configuration data associated with the one or more tool data items to a data collection plan. In a semiconductor manufacturing system, corresponding identification data is located that is indicative of whether a respective component of a semiconductor manufacturing system associated with respective configuration data is at least one of included in the semiconductor manufacturing system or is functional in the semiconductor manufacturing system. A subset of the configuration data for which corresponding identification data was not located removed from the data collection plan and one or more data collection operations are executed at the semiconductor manufacturing system based on the data collection plan.