Semiconductor Tool Data Collection Plan Automation and Validation
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Solution Overview
Problem
Existing semiconductor manufacturing systems require manual setup of Data Collection Plans (DCPs) for each process tool, which is time-consuming and difficult, leading to inefficiencies in data collection and maintenance.
Innovation Solution
A method and system for automatically generating a DCP for a semiconductor manufacturing system, involving initiating a connection with the system, generating tool data items, providing a graphical user interface for user input, adding configuration data to the DCP, validating the data, and executing data collection operations based on the plan.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual setup of Data Collection Plans is performed for each process tool, then customization and accuracy are improved, but time consumption and operational complexity increase
Solution Approach 1:
The system automatically copies and adapts DCP configurations from existing process tools to new tools. The automated generation mechanism replicates proven DCP templates and customizes them based on the specific tool characteristics, maintaining configuration accuracy while eliminating manual setup time
Solution Approach 2:
The system performs preliminary actions by pre-configuring DCP templates with common parameters and structures before deployment. These pre-prepared templates are then automatically instantiated and customized for each process tool, eliminating the need for manual configuration during tool setup
2Measurement precision
If manual setup of Data Collection Plans is performed for each process tool, then configuration accuracy is improved, but ease of operation deteriorates
Solution Approach 1:
The system performs self-service by automatically generating DCP configurations without requiring manual intervention. The automated generation mechanism reads tool specifications, selects appropriate templates, and configures DCP parameters autonomously, dramatically improving ease of operation while maintaining accuracy through validated configuration processes
3Productivity
If automated generation of Data Collection Plans is implemented, then productivity and speed are improved, but device complexity increases
Solution Approach 1:
The system introduces an intermediary automated generation mechanism that acts as a bridge between tool specifications and DCP configurations. This intermediary layer handles the complexity of template selection, parameter mapping, and configuration generation, simplifying the overall process while maintaining high productivity
Data Source
AI summary
A method includes initiating a connection with a semiconductor manufacturing system. The method further includes generating a set of tool data items associated with the semiconductor manufacturing system. The method further includes providing a graphical user interface (GUI) presenting the set of tool data items associated with the semiconductor manufacturing system and receiving and via the GUI, user input selecting one or more of the tool data items. The method further includes adding configuration data associated with one or more of the tool data items to a data collection plan. The method further includes validating the configuration data by locating, in the manufacturing system, a configuration data file associated with the configuration data. The method further includes executing one or more data collection operations based on the data collection plan.