Semiconductor Defect Detection via Intentional Electrical Damage

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Solution Overview

Problem

Identifying and removing semiconductor components with defective or missing electrical couplings from the assembly line is challenging, as these components may not function properly and can escape detection during end-of-assembly electrical tests.

Innovation Solution

A method involving the identification of defective components using detection systems like wire bond detection or vision systems, followed by intentional damage using techniques such as laser cuts, electrically conductive material dispensation, electrostatic discharges, or hydrogen flames to create electrical shorts or opens, ensuring the components malfunction during electrical tests and are removed from the assembly line.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If end-of-assembly electrical tests are performed, then functional defects can be detected, but components with defective electrical couplings may escape detection

Engineering Contradiction:

Improvedefect detection accuracyVSAvoidcomponent quality assurance

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The system performs preliminary detection of electrical coupling integrity before final assembly completion. Wire bond detection systems or vision systems inspect electrical couplings during the assembly process, identifying defective components early before they reach end-of-assembly electrical tests, preventing defective components from escaping detection.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

An intermediary damage induction system is introduced between detection and final testing. When defective electrical couplings are identified, the system intentionally damages the component using lasers, electrostatic discharges, or conductive material dispensation, creating obvious electrical failures that ensure subsequent electrical tests will detect the defect.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If intentional damage is applied to defective components, then defect detection reliability is improved, but manufacturing process complexity increases

Engineering Contradiction:

Improvedefect detection reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The detection system and damage induction system are merged into a single integrated manufacturing line. The wire bond detection system, vision system, and damage induction mechanisms (lasers, electrostatic discharge units, conductive material dispensers) are combined and controlled by a centralized controller, streamlining the process despite the added functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The system automatically detects defective electrical couplings and self-services by applying targeted damage without human intervention. The controller receives detection signals, identifies the precise location and nature of defects, and automatically activates the appropriate damage induction mechanism, eliminating the need for manual inspection and damage application.

Inventive Principle:

Principle #25Self-service

3Reliability

If multiple electrical couplings are used in a component, then functional redundancy is improved, but difficulty in detecting defective couplings increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoiddefect detection difficulty

Core Design Contradiction:

ReliabilityVSDifficulty of detecting and measuring

Solution Approach 1:

Instead of treating all electrical couplings uniformly, the system applies localized detection and damage induction to specific defective couplings. The wire bond detection system or vision system identifies which specific coupling is defective, and the damage induction system targets only that specific location with lasers, electrostatic discharges, or conductive material, rather than affecting the entire component.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively identifies and removes defective semiconductor components by causing them to fail electrical tests, preventing potential field failures and ensuring the quality of the final product.

Implementation Method 1

wherein said damaging comprises using a laser to short one or more electrical connections in the component

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 2

wherein said damaging comprises using a laser to open one or more electrical connections in the component

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 3

wherein said damaging comprises using an electrostatic discharge

Methodology Applied

Scientific EffectElectrostatic discharge: Electrostatic Discharge

Data Source

PatentUS10529632B2Damaging components with defective electrical couplings

Publication Date: 2020.01.07 SEMICON COMPONENTS IND LLC

AI summary

A method, in some embodiments, comprises: providing a component having first and second electrical nodes; determining that the component lacks multiple, functional electrical couplings between said first and second nodes; damaging at least part of the component as a result of said determination; and determining, as a result of said damage, that the component is defective.