Semiconductor Defect Removal with Aligned Detection and Laser Targeting
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Solution Overview
Problem
Current laser cleaning methods for semiconductor substrates lack accuracy in removing defects, as they irradiate the entire surface without identifying specific foreign matter, leading to poor removal precision and difficulty in maintaining accuracy.
Innovation Solution
A defect removal device and method that utilizes position information of defects on a semiconductor substrate, employing a surface defect measurement unit to detect and measure defects, and a removal unit that irradiates the substrate with laser light based on this information to precisely remove the defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the entire surface is irradiated with laser light without identifying specific foreign matter, then the cleaning process can be performed uniformly, but the removal accuracy of foreign matter is poor
Solution Approach 1:
The patent applies preliminary action by using a measurement unit to detect and identify the position information of foreign matter on the semiconductor substrate before laser irradiation. This allows the system to target only the defective areas with laser light, rather than uniformly irradiating the entire surface, thereby improving removal accuracy while maintaining operational efficiency
Solution Approach 2:
The patent implements local quality by directing laser light only to the specific positions where foreign matter is detected, rather than uniformly treating the entire substrate surface. The removal unit irradiates laser light based on position information from the measurement unit, creating localized treatment zones that precisely target defects while leaving other areas unaffected
2Manufacturing precision
If position information of defects is used to target laser irradiation, then removal accuracy is improved, but device complexity increases due to additional measurement and alignment components
Solution Approach 1:
The patent merges the measurement function and laser removal function into a single integrated device. The measurement unit and removal unit are combined in one system, sharing common infrastructure such as the substrate holding mechanism and control system, which reduces overall device complexity compared to using separate independent systems
Solution Approach 2:
The device exhibits multi-functionality by incorporating both measurement and removal capabilities in a single system. The same device can perform both defect detection and defect removal, eliminating the need for separate measurement and treatment equipment, thereby reducing device complexity while maintaining high removal accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-accuracy removal of defects on semiconductor substrates, improving the yield of semiconductor devices by ensuring precise targeting and removal of foreign matter, thereby enhancing the manufacturing process.
Implementation Method 1
a removal unit that irradiates the semiconductor substrate with laser light to remove the defect based on the position information of the defect on the semiconductor substrate
Data Source
AI summary
Provided are a defect removal device and a defect removal method capable of removing defects of a semiconductor substrate with high accuracy, and a pattern forming method and a method of manufacturing an electronic device using the semiconductor substrate from which defects on a surface are removed. The defect removal device includes: a first light source unit that emits incidence light for detecting a defect on a semiconductor substrate; a surface defect measurement unit including a detection unit that detects the defect on the semiconductor substrate based on radiated light radiated by reflection or scattering of the incidence light from the defect of the semiconductor substrate; a removal unit that irradiates the semiconductor substrate with laser light to remove the defect based on position information of the defect on the semiconductor substrate; and an alignment unit that adjusts optical axes of the incidence light and the laser light, in which the optical axes of the incidence light and the laser light are adjusted by the alignment unit such that the incidence light and the laser light are emitted to the semiconductor substrate.