Semiconductor Assembly Internal Deterioration Detection
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Solution Overview
Problem
Existing semiconductor assemblies lack an effective method for detecting deterioration without the need for additional components, as existing methods require an ultrasound generator to be added, which complicates integration and increases costs.
Innovation Solution
A semiconductor assembly with a temperature detection portion and an anode wire, where the anode wire is strategically positioned to detect temperature anomalies by short circuiting with the soldering portion before a chip short circuit occurs, allowing for internal deterioration detection without additional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an ultrasound generator is added to detect deterioration state, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The semiconductor device uses its own internal temperature detection portion and anode wire to detect deterioration, without requiring external inspection equipment. The device monitors its own state through the short circuit detection between the anode wire and soldering portion,实现 self-diagnosis functionality.
Solution Approach 2:
The invention extracts only the essential detection elements (temperature detection portion and anode wire) from a complete ultrasound inspection system. By removing unnecessary components and keeping only the critical short circuit detection mechanism, the solution achieves deterioration detection without the complexity of a full ultrasound generator.
2Reliability
If additional components are added for deterioration detection, then reliability is improved, but ease of manufacture deteriorates
Solution Approach 1:
The temperature detection portion and anode wire are merged into the existing semiconductor device structure. The anode wire is integrated with the soldering portion and insulation layers, combining multiple functions (electrical connection, insulation, and deterioration detection) into a unified structure that simplifies manufacturing.
Solution Approach 2:
The anode wire serves multiple functions: it provides electrical connection to the temperature detection portion, acts as an insulation barrier through its coating, and serves as a detection element for deterioration. This multi-functionality reduces the need for separate components, easing manufacturing.
3Reliability
If safety margins are increased in design, then reliability is improved, but loss of substance increases
Solution Approach 1:
The device performs preliminary detection of deterioration through the anode wire short circuit mechanism before actual failure occurs. By detecting temperature anomalies and short circuit conditions early, the system can take preventive action, reducing the need for excessive safety margins and associated material overhead.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables early detection of temperature anomalies and semiconductor module deterioration, preventing significant failures and reducing the need for excessive safety margins in design, thereby enhancing reliability and reducing costs.
Implementation Method 1
a first insulation layer that blocks the soldering portion and insulates the soldering portion from the anode wire
Implementation Method 2
monitoring a temperature of a temperature detection portion disposed in a semiconductor chip, and detecting a temperature anomaly based on short circuit of an anode wire
Data Source
AI summary
A semiconductor assembly is provided, that includes a semiconductor chip including an upper surface electrode and a lower surface electrode opposite to the upper surface electrode, a metallic wiring plate electrically connected to the semiconductor chip, and a soldering portion that bonds the upper surface electrode of the semiconductor chip to the metallic wiring plate by soldering, the semiconductor chip including a temperature detection portion, an anode wire for the temperature detection portion, and a first insulation layer that blocks the soldering portion and insulates the soldering portion from the anode wire. A deterioration detection method for a semiconductor module is provided, that includes a semiconductor assembly, the deterioration detection method including monitoring a temperature of a temperature detection portion disposed in a semiconductor chip, and detecting a temperature anomaly based on short circuit of an anode wire disposed in the semiconductor chip to detect deterioration of the semiconductor module.