Semiconductor Detector Unit for Radiation Imaging
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Solution Overview
Problem
Existing radiation detector arrays for imaging modalities, such as CT systems, are heavy, consume space, and are costly and time-consuming to manufacture, limiting their efficiency and practicality in various applications.
Innovation Solution
A detector unit comprising a radiation detection sub-assembly and an electronics sub-assembly, fabricated using semiconductor techniques, which converts radiation into digital signals efficiently, allowing for modular and lightweight detector arrays that can be easily integrated into different configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If self-contained detector units with integrated circuits are used, then detector array functionality is achieved, but weight increases
Solution Approach 1:
The patent replaces traditional mechanical/electronic integration methods with semiconductor fabrication techniques. Detector cells, readout circuits, and interconnections are all formed using semiconductor processing on a single substrate, eliminating the need for separate integrated circuits and their supporting mechanical structures, thereby reducing weight while maintaining functionality
Solution Approach 2:
The patent merges multiple previously separate components (detector cells, readout circuits, signal processing elements) into a single integrated semiconductor structure. This consolidation eliminates redundant packaging, mounting hardware, and interconnectors that would add weight, achieving the same functionality with reduced mass
2Reliability
If self-contained detector units with integrated circuits are used, then detector array functionality is achieved, but space consumption increases
Solution Approach 1:
The patent replaces bulky mechanical assembly approaches with planar semiconductor fabrication. All functional elements are created in two dimensions on a thin substrate through photolithography and thin-film deposition, dramatically reducing the z-direction thickness and overall volume compared to stacked or mounted component approaches
Solution Approach 2:
The patent implements a hierarchical integration where readout circuits are positioned directly beneath detector cells, and signal processing elements are integrated within the same substrate layer. This nested arrangement maximizes functional density within the available space, minimizing the detector array's footprint
3Ease of manufacture
If traditional detector unit manufacturing is used, then detector arrays can be produced, but manufacturing time increases
Solution Approach 1:
The patent replaces sequential mechanical assembly operations with parallel semiconductor fabrication processes. Multiple detector cells and their associated circuits are fabricated simultaneously across the entire substrate using wafer-scale processing, reducing manufacturing time from days of assembly to hours of fabrication
Solution Approach 2:
The patent performs preliminary integration of all detector elements and circuits during the semiconductor fabrication process itself, before the detector array is ever assembled into the imaging system. This advance integration eliminates subsequent assembly steps and reduces overall manufacturing lead time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of lightweight, efficient, and cost-effective detector arrays that can be easily configured for various applications, improving the performance and practicality of radiation imaging modalities while reducing manufacturing time and costs.
Implementation Method 1
an indirect conversion technique (e.g., where the radiation is converted into light energy which is then converted into electrical energy)
Implementation Method 2
a photodetector array, respectively configured to detect light energy within a particular spatial region and to generate an analog signal indicative of the detected light energy
Data Source
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AI summary
Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.