Semi-Annular Semiconductor Device Common Screw Mounting
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Solution Overview
Problem
The existing methods for attaching semiconductor devices to a base portion require a large number of screws, increasing the number of work steps and costs.
Innovation Solution
A semiconductor device with a semi-annular device main body featuring cutout portions on its end surfaces, allowing for the use of a common screw to fix two devices together, reducing the number of screws needed and simplifying the attachment process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple semiconductor devices are individually screwed to the base portion, then each device can be securely fixed, but the number of screws and work steps increases
Solution Approach 1:
The patent merges the fixing functions of multiple semiconductor devices by introducing a common screw that passes through cutout portions of multiple devices simultaneously to attach them to the base portion. This combining approach reduces the number of screws needed while maintaining secure fixation of all devices.
Solution Approach 2:
The common screw serves multiple functions: it fixes multiple semiconductor devices to the base portion simultaneously and provides positioning reference for the devices. This multi-functionality reduces the overall number of components and simplifies the attachment structure.
2Reliability
If multiple semiconductor devices are individually screwed to the base portion, then each device can be securely fixed, but the number of work steps increases
Solution Approach 1:
The semiconductor devices are pre-formed with cutout portions at specific locations before attachment. This preliminary preparation enables the common screw to engage multiple devices simultaneously during the attachment process, reducing the number of work steps required.
Solution Approach 2:
The attachment operation is merged into a single step where the common screw secures multiple semiconductor devices to the base portion simultaneously, rather than requiring separate attachment operations for each device. This improves productivity by reducing the total number of work steps.
3Reliability
If multiple semiconductor devices are individually screwed to the base portion, then secure fixation is achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple attachment operations into a single step using a common screw, reducing the total number of screws and fastening operations required. This reduces manufacturing cost by decreasing component quantity and assembly complexity while maintaining reliable attachment.
Solution Approach 2:
The common screw provides multiple functions (fixing multiple devices and positioning) that would otherwise require multiple separate components and operations. This multi-functionality reduces the overall component count and manufacturing cost while ensuring reliable attachment.
Data Source
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AI summary
A semiconductor device includes a device main body that is semi-annular, the device main body having an inner circumferential surface formed arcuate in plan view and an outer circumferential surface formed arcuate in plan view. Cutout portions are formed on a first end surface, on one end side, in a circumferential direction, of the device main body and a second end surface, on an other end side, in the circumferential direction, of the device main body. The cutout portions are used for inserting screws for fixing the device main body to a base portion.