Semiconductor Device Identification Code for Selective Module Operation
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Solution Overview
Problem
As semiconductor devices become smaller and more complex, defects in chip stack packaging and diverse semiconductor modules lead to increased fabrication costs and losses, as defects are often detected only after module assembly, resulting in significant expenses when entire modules must be discarded.
Innovation Solution
A system and method where each semiconductor device or chip in a module outputs a unique identification code, allowing for external selection and control of which devices perform internal operations based on comparison with an applied selection code, enabling selective operation and potential repair or reconfiguration of individual devices within a module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of semiconductor devices or chips mounted on one semiconductor module increases to achieve high capacity, then the module capacity increases, but the probability of defects occurring during fabrication increases
Solution Approach 1:
The patent applies preliminary action by equipping each semiconductor device with an identification code and comparison circuit before module fabrication is complete. This allows defect detection to occur early in the manufacturing process, enabling defective devices to be identified and isolated before the entire module is assembled and tested, thereby preventing waste of resources on defective modules while maintaining high device density
2Measurement precision
If defect detection is performed after semiconductor module fabrication, then comprehensive defect detection is achieved, but fabrication costs increase due to loss of entire modules
Solution Approach 1:
The patent applies segmentation by dividing the defect detection capability into individual semiconductor devices through unique identification codes and comparison circuits. This allows the module to be segmented into functional and defective portions, enabling selective operation of only defective-free devices. Consequently, when a defect is detected, only the specific defective device needs to be abandoned rather than the entire module, significantly reducing fabrication costs while maintaining comprehensive defect detection
3Adaptability or versatility
If diverse semiconductor devices are mounted on a module to achieve platform diversity, then module versatility increases, but the occurrence of defects in particular modules increases
Solution Approach 1:
The patent applies preliminary action by pre-equipping each diverse semiconductor device with an identification code and comparison circuit before module assembly. This enables early detection and isolation of defective devices among diverse components, allowing the system to accommodate platform diversity while maintaining reliability by preventing defective devices from affecting the entire module's performance
Data Source
AI summary
A semiconductor device includes a device identification detection code output block configured to output a device identification detection code to an outside of the semiconductor device when the semiconductor device enters an identification (ID) read mode, a code comparison block configured to compare a device selection code applied from the outside with the device identification detection code when the semiconductor device enters a device selection mode, and generate a device matching signal based on a comparison result, and an internal circuit block configured to decide whether to perform a predetermined internal operation based on the device matching signal when the semiconductor device enters an operation control mode.