Semiconductor Device Lead Structure for Wiring Simplification
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Solution Overview
Problem
Users face increased complexity and risk of miswiring when selecting between current sense and main current detection schemes in power semiconductor modules, requiring custom mounting substrates and additional wiring, which complicates the integration process.
Innovation Solution
A semiconductor device design featuring a semiconductor element with both main and current detection electrodes, integrated circuit, and a lead structure with inner and outer lead parts that can be configured to support either detection scheme, with an outer lead part exposed for easy connection and potential cutting to simplify wiring and detect miswiring through voltage thresholds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the power semiconductor module provides alternative current detection schemes (current sense function and main current detection), then the user has more flexibility in choosing detection methods, but the user must prepare different mounting substrates and perform additional wiring work, increasing device complexity and ease of operation
Solution Approach 1:
The semiconductor device integrates both current sense function and main current detection capability into a single device, allowing the user to select either detection scheme without requiring different mounting substrates or additional wiring. The device universally supports both detection methods through integrated circuitry that can operate in either mode.
Solution Approach 2:
The patent combines the current sense function and main current detection function into a single semiconductor device, merging what would traditionally require separate devices and different mounting configurations into one unified component that simplifies installation and wiring.
2Adaptability or versatility
If the power semiconductor module provides alternative current detection schemes, then the user has more flexibility in choosing detection methods, but the burden of wiring work increases and miswiring may occur, reducing reliability
Solution Approach 1:
The integrated circuit includes a miswiring detection function that monitors the wiring configuration and provides feedback when miswiring is detected. This feedback mechanism prevents incorrect operation and alerts the user to wiring errors, thereby maintaining reliability even while offering flexible current detection scheme selection.
3Adaptability or versatility
If custom mounting substrates are prepared for each current detection scheme, then the current detection function can be properly implemented, but the device complexity and manufacturing cost increase
Solution Approach 1:
The semiconductor device is designed with universal mounting substrate requirements that support both current sense function and main current detection capability. A single standard mounting substrate can be used regardless of which detection scheme is selected, eliminating the need for custom substrates and reducing device complexity.
Data Source
AI summary
A semiconductor device capable of simplifying wiring work is provided. A semiconductor device includes a semiconductor element (insulated gate bipolar transistor IGBT) provided with an emitter main electrode and an emitter sense electrode, an integrated circuit having a detection terminal and a mold resin body that seals the semiconductor element and the integrated circuit, and a lead. The lead is provided with an inner lead part sealed in the mold resin body and electrically connected to the emitter sense electrode, an inner lead part sealed in the mold resin body and electrically connected to the emitter main electrode, and an outer lead part connected to the lead part on one side, connected to the inner lead part on the other side and exposed outside the mold resin body.