Semiconductor Integrated Device Assembly for MEMS Acoustic Transducers
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Solution Overview
Problem
The existing manufacturing process for MEMS acoustic transducers is complex and does not optimize the dimensions of the acoustic chambers, limiting the design freedom and resulting in suboptimal electrical characteristics, particularly in compact applications.
Innovation Solution
A semiconductor integrated device assembly with a package design that includes a base substrate and a cap element forming a cup-shaped structure, where the cap element is a composite substrate with a larger cavity extension than the access opening, allowing for a larger back chamber and reduced horizontal dimensions by vertically superimposing the second die over the first die, optimizing the acoustic performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the existing manufacturing process is used, then the transducer can be produced, but the manufacturing process is complex and design freedom is limited
Solution Approach 1:
The manufacturing process is divided into distinct stages: forming the cavity in the cap element, bonding the cap to the base substrate, and then performing subsequent processing steps. This segmentation allows each stage to be optimized independently, simplifying the overall manufacturing process while maintaining design flexibility for the acoustic chambers.
Solution Approach 2:
The invention transitions from planar packaging to three-dimensional vertical stacking, where the cap element is bonded to the base substrate to form a stacked configuration. This dimensional change enables independent optimization of front and back chamber volumes without increasing lateral footprint, thereby simplifying the manufacturing process while improving design freedom.
2Manufacturing precision
If the existing package design is used, then electrical connection is enabled, but the dimensions of acoustic chambers are not optimized
Solution Approach 1:
The cavity is formed in the cap element before bonding to the base substrate, allowing precise control over the back chamber volume. This preliminary action enables optimization of acoustic chamber dimensions while maintaining design freedom for different transducer configurations and applications.
3Volume of moving object
If compact dimensions are required, then the transducer size is reduced, but the back chamber volume is limited
Solution Approach 1:
The invention uses vertical stacking of the cap element and base substrate to create a three-dimensional configuration. This allows the back chamber volume to be increased in the vertical dimension without increasing the lateral footprint, thereby achieving compact transducer dimensions while maintaining adequate back chamber volume for sensitivity.
Solution Approach 2:
The second die is vertically superimposed over the first die within the package, creating a nested arrangement. This nesting allows both dice to be housed in a compact footprint while the cap element extends beyond to provide the required back chamber volume, resolving the contradiction between compact size and sufficient chamber volume.
4Volume of stationary object
If the cap element cavity extension is larger than access opening, then back chamber volume is increased, but horizontal dimensions increase
Solution Approach 1:
The invention utilizes the vertical dimension by bonding the cap element to the base substrate in a stacked configuration. This allows the cavity in the cap element to extend beyond the access opening in the vertical direction, increasing back chamber volume without significantly increasing horizontal dimensions. The three-dimensional arrangement resolves the contradiction between chamber volume and footprint.
Data Source
AI summary
Described herein is a semiconductor integrated device assembly, which envisages: a package defining an internal space; a first die including semiconductor material; and a second die, distinct from the first die, also including semiconductor material; the first die and the second die are coupled to an inner surface of the package facing the internal space. The second die is shaped so as to partially overlap the first die, above the inner surface, with a portion suspended in cantilever fashion above the first die, by an overlapping distance.