Semiconductor Device Thermal Management via Heat-Conductive Sealing
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Solution Overview
Problem
Conventional semiconductor devices experience insufficient suppression of temperature rise on the upper surface due to exposed lead frames, which can adversely affect the durability of electronic parts mounted on control boards, especially as operating temperatures increase.
Innovation Solution
A semiconductor device design featuring a base plate with a semiconductor chip, a surrounding case, an electrode terminal covered by a heat-conductive sealing material, and a lid with a gap between the sealing material and the lid, preventing electrode terminal exposure and reducing upper surface temperature rise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If lead frames are exposed from the upper face of the resin to the outside air for cooling, then heat dissipation is improved, but the temperature rise on the upper surface of the device is insufficient and durability of electronic parts is adversely affected
Solution Approach 1:
A heat dissipation plate is introduced as an intermediary component between the semiconductor chip and the lid. This plate conducts heat away from the upper surface area, acting as a thermal mediator that prevents heat accumulation on the upper surface without requiring exposed lead frames, thus protecting electronic parts while achieving effective cooling
Solution Approach 2:
The invention transitions from two-dimensional heat dissipation (exposed lead frames on the upper face) to three-dimensional heat management by introducing a heat dissipation plate that extends vertically and provides additional heat conduction pathways, effectively moving heat dissipation to a different spatial dimension
2Reliability
If direct potting resin is used for sealing and insulating semiconductor chips, then reliability is improved and molds are eliminated, but temperature management on the upper surface becomes problematic
Solution Approach 1:
The invention merges multiple functions into the heat dissipation plate: it serves as both a structural component (providing mechanical support and positioning) and a thermal management component (conducting heat away from the upper surface). This integration allows the device to maintain reliability with direct potting resin while solving the temperature management issue
Solution Approach 2:
The heat dissipation plate performs multiple functions simultaneously: it acts as a thermal conduction path, a structural support element, and a spacing component between the sealing material and the lid. This multi-functionality addresses both reliability and temperature management requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses temperature rise on the upper surface of the semiconductor device, minimizing adverse effects on control board-mounted electronic parts and enhancing reliability, particularly suitable for high-temperature operations.
Implementation Method 1
a heat-conductive sealing material
Data Source
AI summary
A semiconductor device includes: a base plate; a semiconductor chip mounted on the base plate; a case surrounding the semiconductor chip on the base plate; an electrode terminal connected to the semiconductor chip; a sealing material covering an upper face of the base plate, the semiconductor chip and a part of the electrode terminal in the case; and a lid fastened to the case above the sealing material, wherein the electrode terminal is not exposed on an upper face of the sealing material, and there is a gap between the upper face of the sealing material and a lower face of the lid.