Semiconductor Device Thermal Estimation Using Net-Aware Grid Segmentation

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Solution Overview

Problem

Conventional thermal analysis of integrated circuits oversimplifies the equivalent thermal conductivity, leading to overestimation and underestimation of temperatures, which can result in missed identification of potential overheating issues due to improper treatment of grid units along non-feedthrough nets.

Innovation Solution

A thermal analysis tool that identifies feedthrough and non-feedthrough nets in integrated circuits, constructing grid units of varying sizes to accurately estimate thermal conductivities for each, allowing for precise calculation of equivalent thermal conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If conventional thermal analysis uses uniform grid units for all nets, then the analysis process is simple, but thermal conductivity is overestimated and temperature accuracy deteriorates

Engineering Contradiction:

Improvethermal analysis process complexityVSAvoidtemperature measurement accuracy

Core Design Contradiction:

Device complexityVSMeasurement precision

Solution Approach 1:

The patent segments the thermal analysis process by distinguishing between feedthrough nets and non-feedthrough nets, and further segments grid units into first grid units (for feedthrough nets) and second grid units (for non-feedthrough nets). This segmentation allows different thermal conductivity estimation methods to be applied to different net types, resolving the contradiction between analysis simplicity and temperature accuracy.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by using different grid unit sizes and thermal conductivity estimation approaches for different locations and net types within the integrated circuit. Specifically, first grid units with first size are used for feedthrough nets while second grid units with second size are used for non-feedthrough nets, allowing locally optimized thermal analysis that improves overall accuracy without excessive complexity.

Inventive Principle:

Principle #3Local quality

2Ease of manufacture

If uniform grid units are used for thermal conductivity estimation, then calculation is easier, but equivalent thermal conductivity becomes inaccurate leading to missed overheating issues

Engineering Contradiction:

Improvecalculation easeVSAvoidoverheating identification reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent segments the calculation process into distinct pathways: one for feedthrough nets using first grid units and another for non-feedthrough nets using second grid units. This segmentation maintains calculation feasibility while improving reliability by ensuring that each net type is analyzed with appropriate grid units, preventing missed overheating issues that would occur with uniform grid usage.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by tailoring the grid unit characteristics to the specific requirements of different net types. First grid units are optimized for feedthrough nets while second grid units are optimized for non-feedthrough nets, ensuring that thermal conductivity estimation is locally accurate for each region, thereby improving overall reliability of overheating identification.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate identification of potentially overheated areas in integrated circuits, optimizing design and reducing resource and time costs by addressing thermal conductivity overestimation.

Implementation Method 1

estimating a first thermal conductivity of each of the first subsets of grid units... estimating a second thermal conductivity of each of the second subsets of grid units... estimating an equivalent thermal conductivity of the integrated circuit

Methodology Applied

Scientific EffectThermal conductivity: Conduction (thermal)

Data Source

PatentUS20250232105A1Systems and methods of estimating thermal properties of semiconductor devices

Publication Date: 2025.07.17 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes: receiving a layout of an integrated circuit; identifying, based on the layout, at least a first net and at least a second net, wherein the first net extends through the integrated circuit along a vertical direction, and the second net terminates at a middle portion of the integrated circuit along the vertical direction; dividing the integrated circuit into a plurality of grid units, wherein he first net is constituted by a first subset of the plurality of grid units, and the second net is constituted by a second subset of the plurality of grid units; estimating a first thermal conductivity of each of the first subsets of grid units; estimating a second thermal conductivity of each of the second subsets of grid units; and estimating an equivalent thermal conductivity of the integrated circuit based on combining the first thermal conductivity and the second thermal conductivity.