Semiconductor Device Parallel Transistors Harmonic Termination
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Solution Overview
Problem
High-frequency power amplifiers in mobile terminals face efficiency losses due to complex front-end circuit configurations and varying inductance components in output wiring, making it difficult to achieve uniform resonant frequencies and load impedances across multiple frequency bands, especially in fifth-generation communication systems.
Innovation Solution
A semiconductor device with multiple unit transistors connected in parallel, each equipped with a common electrode and first capacitors connecting the output electrode to a ground bump, forming a harmonic-termination series resonant circuit to ensure uniform resonant frequencies and enhanced efficiency by matching capacitance and inductance components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple unit transistors are connected in parallel to increase output power, then the output power is improved, but the inductance component of the output wiring varies across transistors causing non-uniform resonant frequencies and reduced efficiency
Solution Approach 1:
The patent divides the common output wiring into separate individual output wirings for each unit transistor. This segmentation eliminates the varying inductance components that occur when multiple transistors share a common output path, ensuring that each transistor experiences identical electrical characteristics and resonant frequencies, thereby maintaining uniformity in the efficiency enhancement operation.
Solution Approach 2:
The patent applies different wiring configurations to different parts of the circuit: individual dedicated output wirings are provided for each unit transistor to ensure uniform local characteristics, while the input wiring remains common to all transistors. This local differentiation ensures that critical output paths have consistent electrical properties without requiring complete isolation of all circuit elements.
2Device complexity
If a common output wiring is used for multiple unit transistors, then the device complexity is reduced, but the inductance component varies causing non-uniform load impedances and reduced amplification efficiency
Solution Approach 1:
The output wiring is segmented into individual dedicated paths for each unit transistor, eliminating the inductance variation problem that occurs with common output wiring. This segmentation, while increasing wiring elements, maintains uniform electrical characteristics across all transistors, ensuring consistent resonant frequencies and load impedances for optimal amplification efficiency.
Solution Approach 2:
The patent applies individual output wirings only to the output stage where inductance uniformity is critical for efficiency enhancement, while keeping the input wiring common. This partial application of the individual wiring approach focuses the complexity only where necessary to achieve the efficiency enhancement goal, without requiring complete individualization of all circuit paths.
3Reliability
If the output wiring inductance is minimized, then the resonant frequency uniformity is improved, but the output power capability is reduced due to lower impedance
Solution Approach 1:
By providing individual output wirings for each unit transistor, the patent eliminates the cumulative inductance variation that occurs in common output configurations. Each transistor sees the same controlled inductance value, ensuring uniform resonant frequencies while maintaining adequate impedance levels for power delivery, as the inductance is determined by the individual wiring geometry rather than being additive across multiple transistors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient high-frequency power amplification by ensuring uniform resonant frequencies and load impedances across transistors, improving power amplifier efficiency and output power, particularly in multi-frequency band operations.
Implementation Method 1
A capacitance of each of the first capacitors and an inductance component of a current path and the ground bump, the current path being a path from each of the unit transistors to the ground bump, serve as a harmonic-termination series resonant circuit
Data Source
AI summary
A plurality of unit transistors that are connected in parallel to each other are formed on a substrate. In addition, a ground bump is provided on the substrate. A plurality of first capacitors are each provided for a corresponding one of the plurality of unit transistors and each connect an output electrode of the corresponding one of the plurality of unit transistors and the ground bump to each other.