Semiconductor Device Internal Transmission Path Signal Swing Reduction
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Solution Overview
Problem
High bandwidth memory (HBM) devices face increased power consumption due to high signal swing levels in internal I/Os, which limits their efficiency and scalability in data processing and storage.
Innovation Solution
A semiconductor device design that minimizes signal swing width through the use of N-over-N drivers and strong-arm latch type sense amplifiers, along with decision feedback equalizers (DFE) to compensate for inter-symbol interference, allowing simultaneous initialization of transmission and reception circuits to reduce power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the swing level of signals transmitted through internal I/O is increased to improve signal transmission stability, then the reliability of data transmission is improved, but the power consumption increases significantly
Solution Approach 1:
The patent divides the transmission path into multiple segments with different swing levels. Internal transmission paths use lower swing levels to reduce power consumption, while external interfaces maintain higher swing levels for reliable signal transmission. This segmentation allows the system to optimize power consumption without sacrificing transmission reliability where needed.
Solution Approach 2:
Different parts of the transmission system are assigned different signal swing characteristics based on their specific requirements. Internal I/O paths use low swing levels for power efficiency, while external interfaces use high swing levels for reliability. This local quality differentiation resolves the contradiction by applying appropriate swing levels only where needed.
2Productivity
If the number of internal I/O channels is increased to improve data processing capability, then the productivity of the semiconductor device is improved, but the power consumption increases due to more high-swing signal transmissions
Solution Approach 1:
The patent segments the I/O channels into internal and external categories, applying different swing level strategies to each. Internal channels operating at lower swing levels contribute to data processing capability while consuming less power per channel, enabling higher overall productivity without linear power increases.
3Measurement precision
If high swing levels are used in internal I/O to ensure reliable signal detection, then the measurement precision of signal levels is improved, but the magnitude of power consumption increases
Solution Approach 1:
The patent applies different signal quality characteristics to different locations in the system. Internal transmission paths use lower swing levels with adequate detection precision for their requirements, while external interfaces use higher swing levels where maximum detection accuracy is critical. This local quality approach ensures sufficient measurement precision without unnecessary power consumption.
Data Source
AI summary
A semiconductor device comprising: a first or a second path configured to transmit a first signal which swings between a ground level and a first level, a third path configured to transmit a second signal which swings between the ground level and a second level lower than the first level, a transmitter configured to output received the first signal through the first or second path as the second signal to the third path, and initialize in response to an enable signal, and a receiver configured to output received the second signal through the third path as the first signal through the first or second path, determine level of the second signal through a reference level that is regulated according to a fed-back level of an output terminal thereof, and initialize in response to the enable signal.