Semiconductor Device One-Sided Via Contact Resin Layer
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Solution Overview
Problem
Conventional semiconductor packages require double-sided processing for via contacts and interconnects, prolonging the manufacturing process and increasing costs due to the need for materials and specialized equipment.
Innovation Solution
A semiconductor device design where via contacts and interconnects are formed on one surface of a resin layer, eliminating the need for double-sided processing, with a metal layer having a larger surface area than the semiconductor chip to facilitate one-sided processing and reduce manufacturing complexity and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via contacts and interconnects are provided both on the front surface and the rear surface of the semiconductor package, then electrical connection between interconnects and pads is achieved, but the manufacturing process is prolonged and more materials are required
Solution Approach 1:
The invention transitions from a dual-sided (front and rear surfaces) configuration to a single-sided configuration by extending interconnects through the resin layer to contact pads on the front surface. This dimensional reorganization eliminates the need for rear surface via contacts while maintaining electrical connectivity, thereby reducing manufacturing complexity and process time.
2Reliability
If via contacts and interconnects are provided both on the front surface and the rear surface of the semiconductor package, then electrical connection between interconnects and pads is achieved, but more materials are required
Solution Approach 1:
The invention extracts and eliminates the rear surface via contacts from the conventional dual-sided structure. By removing this redundant component and reconfiguring the interconnects to extend through the resin layer, the design reduces material consumption while preserving the essential electrical connection function between interconnects and pads.
3Ease of manufacture
If a metal layer with larger surface area than the semiconductor chip is used, then one-sided processing is enabled, but the device structure becomes more complex
Solution Approach 1:
The metal layer serves multiple functions: it provides the rear surface electrode for electrical connection, acts as a structural support base for mounting the semiconductor chip, and enables one-sided processing by extending beyond the chip perimeter to facilitate through-resin interconnect formation. This multi-functionality justifies the increased surface area despite the apparent structural complexity.
Data Source
AI summary
A semiconductor device includes a first semiconductor chip having a first surface with a semiconductor element and a second surface opposing the first surface. A first metal layer has a third surface supporting the first semiconductor chip and a fourth surface opposing the third surface. The third surface is larger than the second surface. A resin layer has a fifth surface facing the first semiconductor chip and a sixth surface facing the first metal layer. A pad is on the first surface of the first semiconductor chip. A first via contact is within the resin layer on the third surface of the first metal layer. A second via contact is within the resin layer on the pad. The first and second via contacts are connected to first and the second interconnects, respectively.