Semiconductor Dicing Groove Tape Adhesive Remnant Removal
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Solution Overview
Problem
The existing semiconductor device manufacturing methods using dicing processes often result in dust such as silicon remnants, adhesive remnants, and tape remnants adhering to the chips, which deteriorate the quality of the semiconductor device.
Innovation Solution
A method involving forming a groove portion on the semiconductor substrate, bonding a tape with adhesive material, dividing the substrate into chips along a scribing line, and drawing the adhesive material from the opposite surface to collect and remove dicing remnants with the tape, thereby preventing them from adhering to the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a dicing process is performed to divide the semiconductor substrate into chips, then the chips are separated and can be individually processed, but dicing remnants (dust) are generated and attach to the chips, deteriorating device quality
Solution Approach 1:
The patent introduces groove portions that divide the space between chips into multiple regions (first space and second space). This segmentation allows different functional zones: the first space collects dicing remnants while the second space maintains chip cleanliness. The groove portions act as physical barriers that segment the potential contamination zone from the chip surface.
Solution Approach 2:
The patent extracts dicing remnants from the chip surface area by directing them into the groove portions during the dicing process. The groove portions serve as extraction zones where harmful dust particles are separated and collected away from the chips, preventing them from attaching to the chip surfaces.
2Strength
If adhesive material is applied directly onto the semiconductor substrate surface, then the chips are securely held during processing, but dicing remnants can easily attach to the adhesive material and transfer to chips
Solution Approach 1:
The adhesive material is segmented into different regions: some adhesive fills the groove portions to create a dust collection zone, while other adhesive remains on the substrate surface for bonding. This segmentation allows the adhesive to serve dual functions: maintaining strong bonding while creating protected zones that prevent dust transfer to chips.
Solution Approach 2:
The groove portions act as intermediary zones between the adhesive material and the chips. These grooves serve as buffer regions where dicing remnants are trapped before they can reach the chips, mediating the interaction between the adhesive/dicing process and the chip surfaces.
3Ease of operation
If the tape is removed after dicing, then the chips are released for individual processing, but any dicing remnants attached to the adhesive remain on the chips, deteriorating quality
Solution Approach 1:
The patent extracts dicing remnants from the chip-adhesive interface by collecting them in the groove portions during the dicing process. When the tape is later removed, the remnants remain trapped in the grooves or are easily removed with the tape, preventing them from being transferred to the chips during the release operation.
Solution Approach 2:
The patent performs preliminary collection of dicing remnants in the groove portions during the dicing process itself, before the tape removal step. This preliminary action ensures that when the tape is later removed for chip release, the harmful remnants have already been captured and will not be transferred to the chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively removes dicing remnants from the semiconductor chips, enhancing the quality of the semiconductor device by ensuring that they are detached with the tape during the manufacturing process.
Implementation Method 1
a step of drawing the adhesive material from a second surface of the semiconductor substrate, opposite to the first surface, so that the adhesive material enters into the space
Data Source
AI summary
In a manufacturing method of a semiconductor device, a tape having an adhesive material is bonded to a first surface of a semiconductor substrate so as to form a space between a groove portion and the adhesive material of the tape, the semiconductor substrate is divided into a plurality of chips by a dicing, and the adhesive material is drawn from a second surface of the semiconductor substrate opposite to the first surface so that the adhesive material enters into the space. Therefore, dicing remnants remaining in the space during the drawing adhere on the adhesive material, and can be removed together with the adhesive material when the semiconductor substrate is removed from the tape to form divided chips. Accordingly, the quality of the semiconductor device can be improved.