Semiconductor Laser Dicing With Material-Based Energy Adjustment
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Solution Overview
Problem
Current semiconductor dicing methods, such as mechanical sawing and laser dicing, face challenges in achieving consistent trench depths and avoiding damage to seal rings, leading to reliability issues and reduced packaging yield.
Innovation Solution
A laser system that includes a laser source and a movable laser energy adjusting unit, which adjusts the laser energy based on the material type along the cutting street, and a splitter to generate multiple dicing energies for parallel tracks, ensuring consistent dicing and minimizing trench depth variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a fixed high-power laser is used for dicing, then the dicing speed is high, but the trench depth varies and seal rings may be damaged
Solution Approach 1:
The patent applies dynamics by making the laser energy adjustable rather than fixed. The laser energy adjusting unit dynamically changes the laser energy based on the material type being diced, allowing the system to adapt between high-speed dicing of certain materials and precise low-energy dicing of others, thereby resolving the contradiction between dicing speed and trench depth consistency
Solution Approach 2:
The patent changes the laser energy parameter according to material type. By adjusting the laser energy parameter dynamically during the dicing process, the system can maintain optimal dicing speed for each material while ensuring consistent trench depth and preventing seal ring damage, thus resolving the contradiction between productivity and manufacturing precision
2Productivity
If high laser energy is used to ensure dicing speed, then productivity is high, but seal rings may be damaged
Solution Approach 1:
The patent applies local quality by adjusting laser energy according to the specific material type being diced. Different regions (material types) receive appropriately tailored laser energy levels, ensuring high dicing speed where possible while protecting seal rings from damage by using lower energy when encountering them, thus resolving the contradiction between productivity and avoiding harmful effects
3Manufacturing precision
If laser energy is adjusted for different materials, then trench depth consistency is improved, but the system complexity increases
Solution Approach 1:
The patent applies universality by designing a laser energy adjusting unit that can handle multiple material types with a single mechanism. This multi-functional unit can adjust laser energy for different materials, ensuring trench depth consistency across various material types without requiring separate dicing systems for each material, thus resolving the contradiction between manufacturing precision and device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system improves the consistency of laser grooving and reduces chip collapse, enhancing the packaging yield by adjusting laser energy according to material types and using multiple dicing energies for parallel tracks.
Implementation Method 1
A trench is formed on the wafer by a laser source along a cutting street
Implementation Method 2
The laser energy adjusting unit is moved to the laser light path between the laser source and the semiconductor structure based on a first determination that the laser source is focused on a first preset region of the semiconductor structure having a first material
Data Source
AI summary
A laser system for dicing a semiconductor structure is disclosed. The laser system includes a laser source and a laser energy adjusting unit. The laser source is configured to generate a laser. The laser energy adjusting unit is movably provided on a laser light path between the laser source and the semiconductor structure. The laser energy adjusting unit is moved to the laser light path between the laser source and the semiconductor structure based on a first determination that the laser source is focused on a first preset region of the semiconductor structure having a first material. The laser energy adjusting unit is configured to reduce or weaken laser energy on the laser light path.