Semiconductor Die Imaging for Accurate 3D Marking Alignment
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Solution Overview
Problem
Existing semiconductor post-processes face challenges in accurately identifying distortions and bendings of semiconductor dies after the molding process, which can lead to errors in subsequent processes like marking.
Innovation Solution
A test device equipped with a first image capture device for two-dimensional imaging and multiple second image capture devices for three-dimensional imaging, controlled by a processor to generate final three-dimensional image data for precise marking processes, using process scenario information to adaptively adjust imaging parameters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple second image capture devices are used for three-dimensional imaging, then measurement precision of distortions and bendings is improved, but device complexity increases
Solution Approach 1:
The system dynamically selects which second image capture device to activate based on process scenario information. The processor determines the appropriate device from the plurality of second image capture devices according to the specific marking process requirements, making the system adaptable rather than statically complex
Solution Approach 2:
The system changes the activation state of image capture devices based on process parameters. By activating only one second image capture device at a time based on process scenario information, the system maintains measurement precision while managing device complexity through parameter-based control
2Manufacturing precision
If three-dimensional image data is generated for all semiconductor dies, then manufacturing precision of marking process is improved, but loss of time increases
Solution Approach 1:
The system performs preliminary selection of the appropriate second image capture device based on process scenario information before generating three-dimensional image data. This preliminary action optimizes the subsequent data generation process by pre-determining which device should be activated
Solution Approach 2:
Instead of activating all second image capture devices simultaneously, the system activates only one device at a time based on process requirements. This partial action approach generates the necessary three-dimensional image data with acceptable precision while significantly reducing the time loss compared to using all devices
Data Source
AI summary
A test device including a first image capture device, a plurality of second image capture devices, and a processor may be provided. The first image capture device captures a semiconductor substrate including a plurality of semiconductor dies and generates two-dimensional image data. Each of the plurality of second image capture devices captures the semiconductor substrate and generates three-dimensional image data when activated. The processor activates one of the plurality of second image capture devices based on process scenario information related to semiconductor post-processes, the semiconductor post-processes including a marking process for the plurality of semiconductor dies, and generates final three-dimensional image data for performing the marking process based on the two-dimensional image data and the three-dimensional image data.