Semiconductor Die Array Encapsulation via Trench Filling
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Solution Overview
Problem
Current semiconductor device encapsulation methods are inefficient, leading to increased manufacturing time and package size due to the need for individual mounting of semiconductor die, which can result in damage and reduced throughput.
Innovation Solution
A method involving the formation of trenches between semiconductor die on a wafer, allowing for simultaneous mounting and encapsulation of die as a single unit, with the encapsulant deposited into these trenches to provide structural support and environmental protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual semiconductor die are singulated and mounted on a carrier, then the die can be encapsulated, but the manufacturing time increases and throughput decreases
Solution Approach 1:
The patent combines multiple die into a die array that is mounted as a single unit on the carrier, rather than mounting individual die separately. This merging approach allows simultaneous encapsulation of multiple die, significantly reducing manufacturing time and increasing throughput while still providing protection to each die.
Solution Approach 2:
The patent forms trenches between the die in the array before mounting the entire array on the carrier. This preliminary action of creating the encapsulation structure beforehand allows for efficient subsequent encapsulation processing, reducing overall manufacturing time compared to individual die processing.
2Reliability
If individual semiconductor die are mounted on a carrier, then encapsulation can be performed, but the distance between die and encapsulant increases leading to larger package size
Solution Approach 1:
By mounting multiple die as a compact array on the carrier with trenches formed between them, the patent enables the encapsulant to closely contact the die surfaces. This merged array approach minimizes the distance between die and encapsulant, resulting in a smaller overall package footprint compared to individually mounted die.
3Ease of manufacture
If individual semiconductor die are handled and mounted, then encapsulation is possible, but the die are fragile and can be damaged during attachment
Solution Approach 1:
The patent combines multiple die into a rigid array structure that is mounted as a single unit on the carrier. This merged structure provides mechanical support to individual die, reducing fragility and preventing damage during the mounting and encapsulation processes that would otherwise affect individually handled die.
4Productivity
If trenches are formed between die and wafer is removed, then encapsulation can be deposited directly into trenches, but the manufacturing process becomes more complex
Solution Approach 1:
The patent forms trenches between the die in the array before mounting on the carrier. This preliminary formation of encapsulation cavities allows the encapsulant to be directly deposited into the trenches in a single step, improving encapsulation efficiency. Although this adds a trench formation step, it eliminates the need for more complex individual die encapsulation processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances throughput and reduces package size by simplifying the manufacturing process, minimizing damage to semiconductor die, and ensuring consistent encapsulation, resulting in more robust and uniformly functional semiconductor devices.
Implementation Method 1
depositing an encapsulant over the semiconductor die and into the trench
Data Source
Figure 1a~1b
Figure 1c~1d
Figure 1e~1f
AI summary
A semiconductor device has a semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die. An insulating layer is formed over an active surface of the semiconductor die. A trench is formed in a non-active area of the semiconductor wafer between the semiconductor die. The trench extends partially through the semiconductor wafer. A carrier with adhesive layer is provided. The semiconductor die are disposed over the adhesive layer and carrier simultaneously as a single unit. A backgrinding operation is performed to remove a portion of the semiconductor wafer and expose the trench. The adhesive layer holds the semiconductor die in place during the backgrinding operation. An encapsulant is deposited over the semiconductor die and into the trench. The carrier and adhesive layer are removed. The encapsulated semiconductor die are cleaned and singulated into individual semiconductor devices. The electrical performance and functionality of the semiconductor devices are tested.