Semiconductor Die Cable Interposer for Low Latency Memory
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Solution Overview
Problem
Existing packaging techniques for semiconductor dies face challenges in high-bandwidth and low-latency communication, particularly when coupling memory devices with semiconductor chips or dies using capacitive or proximity connectors, as they often require precise alignment and are limited by latency and bandwidth over longer distances in multi-chip modules.
Innovation Solution
The solution involves a semiconductor die with proximity connectors configured for capacitive coupling, coupled with a flexible cable having varying flexibility compliance sections to allow for self-alignment and positioning perpendicular to the plane, enabling efficient communication between semiconductor dies and memory devices, including dynamic and static memory, with voltage regulators and electro-optic transceivers for power and signal distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If memory devices are located at a significant distance from the CPU and communicate via high-frequency data bus, then system coverage is expanded, but communication latency increases and bandwidth is limited
Solution Approach 1:
The patent transitions from planar PCB routing to three-dimensional vertical stacking, placing memory devices directly above/below processor dies through interposer technology. This dimensional change enables simultaneous achievement of long communication distance (multiple memory devices) and low latency (direct vertical paths without lateral routing).
Solution Approach 2:
The patent introduces an interposer as an intermediary substrate between processor dies and memory devices. This interposer provides standardized connection interfaces, enabling modular assembly and reducing assembly complexity while maintaining high-speed signal integrity across the extended distance.
2Power
If proximity connectors are used for capacitive coupling between chips, then communication bandwidth is enhanced, but alignment precision requirements increase
Solution Approach 1:
The patent implements self-aligning connector designs with mechanical features such as guide pins, alignment keys, and compliant elements that automatically compensate for manufacturing tolerances during assembly. This self-service alignment mechanism reduces the burden on precision manufacturing while maintaining high bandwidth capacitive coupling.
Solution Approach 2:
The patent employs compliant interconnect structures that can elastically deform to accommodate misalignment, effectively changing the mechanical parameters (flexibility, compliance) of the connection system. This allows proximity connectors to maintain optimal capacitive coupling despite variations in alignment precision.
3Productivity
If multiple layers and narrow critical dimensions are used in motherboard design, then system performance is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent divides the traditional monolithic motherboard into separate functional modules: processor packages, memory modules, and an interposer substrate. This segmentation allows each component to be optimized independently and assembled through standardized interfaces, reducing overall system complexity while maintaining high performance.
Solution Approach 2:
The patent replaces complex multi-layer PCB routing with three-dimensional vertical interconnections through the interposer, substituting lateral signal paths with direct vertical paths. This mechanical reconfiguration simplifies the interconnect architecture while enabling higher bandwidth and lower latency.
4Ease of operation
If cable flexibility compliance is increased to allow perpendicular positioning, then assembly flexibility is improved, but structural stability may be compromised
Solution Approach 1:
The patent implements a cable assembly with non-uniform flexibility characteristics: rigid sections near connection points for stability, and flexible intermediate sections for positioning freedom. This local differentiation of mechanical properties allows the cable to simultaneously achieve structural stability at connection interfaces and assembly flexibility in intermediate regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces misalignment issues, enhances data signal communication bandwidth, and lowers latency between processors and memory, improving overall system performance while reducing manufacturing and assembly costs by allowing for less precise alignment and more flexible assembly processes.
Implementation Method 1
The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors proximate to and/or coupled to the first surface
Implementation Method 2
A third section of the cable may have a third flexibility compliance greater than the second threshold value. The third flexibility compliance of the third section may allow at least a portion of the cable to be positioned substantially perpendicular to a plane including the first surface
Data Source
AI summary
A device includes a first semiconductor die having a first surface and a second surface, a cable coupled to the first semiconductor die, and at least one memory device coupled to the cable. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors proximate to and/or coupled to the first surface.