Semiconductor Die Mounting with Conformal Parylene Coating

Solution Overview

Problem

Conventional methods for mounting semiconductor dies on supports, such as substrates or other dies, often require adhesives like epoxy or film adhesives, which can be cumbersome and may not provide adequate electrical insulation or protection during assembly and handling.

Innovation Solution

A conformal coating, typically made from organic polymers like parylene, is applied to the semiconductor die and support surfaces, providing adhesion and electrical insulation without the need for additional adhesives, and can be formed through deposition processes like vapor or liquid phase deposition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesive is used to mount semiconductor die on support, then adhesion is achieved, but electrical insulation and protection during assembly are insufficient

Engineering Contradiction:

Improveelectrical insulationVSAvoidadhesive application process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the adhesion function and electrical insulation function into a single conformal coating layer applied to the semiconductor die. This eliminates the need for separate adhesive materials and steps, providing both mechanical bonding and electrical protection simultaneously while reducing process complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conformal coating serves multiple functions: it provides adhesion between the die and support, electrical insulation to prevent short circuits, and physical protection during assembly and handling. This multi-functional approach replaces traditional single-function adhesive applications

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Ease of manufacture

If conformal coating is applied to die and support surfaces, then adhesion and electrical insulation are provided without additional adhesives, but deposition process complexity increases

Engineering Contradiction:

Improveadhesive-free mountingVSAvoiddeposition process

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The conformal coating is applied in a manner that allows it to self-adhere to both the die and support surfaces through the deposition process, eliminating the need for separate adhesive application and curing steps. The coating material inherently provides both bonding and insulation properties

Inventive Principle:

Principle #25Self-service

3Reliability

If conventional adhesive mounting is used, then die attachment is achieved, but physical damage during handling occurs

Engineering Contradiction:

Improveprotection during handlingVSAvoiddie attachment strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The conformal coating is applied beforehand to create a protective cushioning layer on the die surface. This layer provides mechanical protection during assembly and handling operations while simultaneously maintaining strong adhesion to the support, preventing both damage and attachment failures

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for secure adhesion and electrical insulation of semiconductor dies on supports, reducing physical damage during handling and enabling efficient electrical connections through openings in the coating, facilitating the assembly of stacked die configurations.

Implementation Method 1

A conformal coating, typically made from organic polymers like parylene, is applied to the semiconductor die and support surfaces, providing adhesion and electrical insulation without the need for additional adhesives, and can be formed through deposition processes like vapor or liquid phase deposition.

Methodology Applied

Scientific EffectVapor deposition: Physical Vapour Deposition

Implementation Method 2

A conformal coating, typically made from organic polymers like parylene, is applied to the semiconductor die and support surfaces, providing adhesion and electrical insulation without the need for additional adhesives, and can be formed through deposition processes like vapor or liquid phase deposition.

Methodology Applied

Scientific EffectLiquid phase deposition: Deposition (physical)

Data Source

PatentUS9252116B2Semiconductor die mount by conformal die coating

Publication Date: 2016.02.02 ADEIA SEMICON TECH LLC

AI summary

A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.