Semiconductor Die Conversion Coating for Adhesion
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Solution Overview
Problem
Embedded die packages face adhesion failures and delamination issues due to lack of effective adhesion between conductive elements and insulating substrates, particularly in designs without conversion coatings.
Innovation Solution
A conversion coating, including zirconium and vanadium, is applied over the conductive elements, such as electrical contacts or backside contact layers, to enhance adhesion between the conductive elements and the insulating substrate, with a zinc layer protecting the copper elements from oxidation and facilitating the coating application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If no conversion coating is applied between the conductive element and insulating substrate, then the manufacturing process is simpler, but adhesion failure and delamination occur
Solution Approach 1:
A conversion coating layer is introduced as an intermediary between the conductive element (copper with zinc layer) and the insulating substrate. This conversion coating, containing zirconium and vanadium, serves as a mediator that promotes chemical bonding and adhesion between the two materials, preventing delamination while maintaining manufacturing feasibility through a controlled deposition process
2Reliability
If a conversion coating with zirconium and vanadium is applied over the zinc layer, then adhesion between conductive element and substrate is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The solution employs a composite coating structure consisting of multiple layers: a zinc layer applied directly to the copper conductive element, followed by a conversion coating layer containing zirconium and vanadium. This composite structure combines the oxidation protection and coating receptivity of zinc with the strong adhesion properties of zirconium-vanadium conversion coating, achieving reliable bonding while managing complexity through a systematic multi-layer approach
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conversion coating significantly reduces adhesion failures and delamination, improving the reliability of electrical connections and the overall performance of embedded die packages by promoting strong adhesion between the die and the substrate.
Implementation Method 1
the zinc layer both protecting the copper element from oxidation and being receptive to the conversion coating
Implementation Method 2
The conversion coating promotes adhesion between the conductive element of an embedded die and the electrically insulating substrate
Data Source
AI summary
A die includes a semiconductor layer, an electrical contact on a first side of the semiconductor layer, a backside electrical contact layer on second side of the semiconductor layer. The die further includes a zinc layer over at least one of the electrical contact or the backside electrical contact layer of the die, and a conversion coating over the zinc layer. The conversion coating includes at least one of zirconium and vanadium. As part of an embedded die package including the die, at least a portion of the conversion coating may adjacent to an electrically insulating substrate of the embedded die package.