Semiconductor Die Embedding in Substrate Cavities
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Solution Overview
Problem
Conventional semiconductor device packaging methods expose unpackaged dies to lateral forces, leading to dislodgment and failure due to inadequate support and protection, and the sealing process may fail over time, causing environmental exposure.
Innovation Solution
A direct transfer apparatus and process that embeds semiconductor dies into a product substrate using a machine that aligns and secures unpackaged dies from a wafer tape to a circuit substrate, reducing the thickness of the end product and enhancing adhesion, thereby minimizing the risk of dislodgment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional packaging methods are used to mount dies onto packages, then the die can be connected to pins/wires for interfacing, but the die is exposed to lateral forces and may be dislodged or sheared off due to inadequate support and protection
Solution Approach 1:
The die is embedded within a cavity in the substrate, creating a nested structure where the die sits inside a recessed area. This nesting provides lateral support and protection from dislodgment while maintaining electrical connections through the substrate, resolving the contradiction between ease of connection and reliability against lateral forces.
Solution Approach 2:
The invention transitions from surface mounting (2D placement on package top) to embedded mounting (3D placement within substrate cavity). By moving the die into a third dimension (depth), the structure gains lateral support from the cavity walls while maintaining electrical connectivity, thus improving reliability without sacrificing connection capability.
2Object-affected harmful factors
If sealants are used to protect the die from the environment, then protection from dust is provided, but the sealant may become worn and fail over time, causing the die to become exposed to environmental elements
Solution Approach 1:
The invention removes the die from the vulnerable surface position and extracts it into a protected cavity within the substrate. This eliminates the need for external sealants that wear over time, as the cavity structure itself provides permanent environmental protection, thereby extending the duration of protection indefinitely.
Solution Approach 2:
The cavity structure serves as pre-established protection against environmental factors. By embedding the die beforehand into a recessed cavity, the structure provides inherent shielding from dust and contaminants, eliminating reliance on deteriorating sealant materials for long-term protection.
3Ease of operation
If the die is mounted elevated above the package, then the die can be connected to pins/wires, but the elevated height exposes the die to lateral forces and makes it vulnerable to dislodgment
Solution Approach 1:
The die is nested within a substrate cavity, providing lateral support from the cavity walls. This nested configuration maintains electrical connection capability through the substrate while dramatically improving attachment strength by preventing lateral movement and dislodgment, resolving the contradiction between connection ease and attachment strength.
Data Source
AI summary
An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The transfer surface includes ripples in a profile thereof such that an apex on an individual ripple is a point on a first plane and a trough on the individual ripple is a point on a second plane. The semiconductor die is disposed on the transfer surface between the first plane and the second plane such that the second surface of the semiconductor die extends transverse to the first plane and the second plane.