Semiconductor Die Heat Dissipation via Encapsulant Dam
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Solution Overview
Problem
Semiconductor devices face challenges in efficiently radiating heat generated during operation, which affects signal transmission rates and lifespan, as existing technologies do not effectively isolate the semiconductor die from encapsulants, leading to inadequate heat dissipation.
Innovation Solution
The semiconductor device incorporates an encapsulant dam that isolates the semiconductor die from the encapsulant, exposing its upper surface to the ambient environment for efficient heat radiation, while also using pre-solder balls and solder balls for electrical connections, allowing for efficient heat dissipation and reduced fabrication costs through laser drilling processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor die is fully enclosed by encapsulant, then protection and structural integrity are improved, but heat radiation efficiency deteriorates
Solution Approach 1:
The encapsulation structure is segmented into two distinct regions: a first encapsulant region that fully encloses the semiconductor die for protection, and a second encapsulant region that is spaced apart from the die to allow heat radiation. This segmentation enables simultaneous achievement of protection and heat dissipation functions.
Solution Approach 2:
A barrier layer is introduced as an intermediary component between the semiconductor die and the second encapsulant region. This barrier layer prevents the encapsulant from contacting the die while allowing thermal energy to pass through, enabling heat radiation without direct exposure of the die.
2Temperature
If the semiconductor die is exposed to ambient environment, then heat radiation efficiency is improved, but protection and structural integrity deteriorate
Solution Approach 1:
The encapsulation is divided into protective and non-protective zones. The first encapsulant region provides full protection, while the second encapsulant region creates a controlled exposure zone that allows heat radiation without complete exposure to the ambient environment.
Solution Approach 2:
The barrier layer serves as a mediator that enables controlled interaction between the semiconductor die and the external environment, allowing thermal energy transfer while maintaining physical protection and structural integrity.
3Ease of manufacture
If encapsulant is applied directly over semiconductor die, then fabrication process is simplified, but heat dissipation capability deteriorates
Solution Approach 1:
The fabrication process is segmented into distinct stages: forming the first encapsulant region, depositing the barrier layer, and forming the second encapsulant region. This segmentation, while adding steps, enables precise control over heat dissipation paths without compromising overall manufacturability.
Solution Approach 2:
The barrier layer is deposited as an intermediary step in the fabrication process using standard techniques such as sputtering or CVD. This additional layer, though requiring extra process steps, enables effective heat dissipation while maintaining compatibility with existing manufacturing capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat radiation efficiency, improves signal transmission rates, and extends the lifespan of semiconductor devices by isolating the semiconductor die from encapsulants and enabling easy electrical connections, thereby addressing the heat management issues in semiconductor devices.
Implementation Method 1
heat generated by the semiconductor die 130 may be efficiently radiated through the upper surface 130a
Implementation Method 2
upper surface 130a of the semiconductor die 130 is exposed directly to the ambient environment
Implementation Method 3
via apertures 170a extending through the encapsulant 170 to expose the upper parts of the pre-solder balls 160
Data Source
AI summary
Disclosed are a semiconductor device capable of efficiently radiating heat of a semiconductor die and a method of fabricating the same. The semiconductor device efficiently radiates the heat by preventing an encapsulant from reaching the semiconductor die by an encapsulant dam so that an upper surface of the semiconductor die is exposed out of the encapsulant. In addition, the semiconductor device is configured to expose a pre-solder ball or a conductive pattern of a substrate through a via of the encapsulant. Therefore, electrical connection between the pre-solder ball and a solder ball of another semiconductor device stacked thereon is easily achieved.