Semiconductor Die Encapsulation for Warpage Control

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Solution Overview

Problem

Conventional methods of manufacturing semiconductor devices often result in damage to semiconductor die during transfer due to mechanical stress and thermal expansion differences between the die and encapsulants, leading to reliability issues.

Innovation Solution

A method involving the preparation of a semiconductor wafer with multiple die, sawing to separate them, arranging on an adhesive member, encapsulating with a material like epoxy-based resin, and a second sawing operation to form individual encapsulated die, which reduces warpage and enhances transfer reliability by controlling thermal expansion and mechanical stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If semiconductor die are separated and transferred individually, then mounting flexibility is improved, but mechanical damage risk increases

Engineering Contradiction:

Improvemounting flexibilityVSAvoiddamage risk

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies preliminary action by forming an encapsulant around the semiconductor die before the sawing and separation process. This encapsulation is done in advance to protect the die during subsequent handling and transfer operations, reducing mechanical damage risk while maintaining mounting flexibility

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The encapsulant serves as a cushioning layer formed beforehand to absorb mechanical stress and protect the semiconductor die during transfer. This prior cushioning prevents direct contact between the fragile die and external forces, reducing damage risk during individual handling and mounting

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If encapsulant is applied before sawing, then die protection is improved, but warpage control becomes difficult

Engineering Contradiction:

Improvedie protectionVSAvoidwarpage

Core Design Contradiction:

ReliabilityVSShape

Solution Approach 1:

The patent applies parameter changes by carefully controlling the thermal expansion coefficient of the encapsulant material to match that of the semiconductor die. This parameter matching reduces differential thermal stress during curing and heating processes, preventing warpage while maintaining die protection benefits

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The encapsulant is applied with different properties in different regions: it provides mechanical protection where needed while having controlled thermal expansion characteristics in areas subject to heating. The local quality variation allows simultaneous achievement of die protection and warpage control

Inventive Principle:

Principle #3Local quality

3Shape

If encapsulant thermal expansion coefficient matches die, then warpage is reduced, but material selection becomes limited

Engineering Contradiction:

Improvewarpage reductionVSAvoidmaterial selection

Core Design Contradiction:

ShapeVSAdaptability or versatility

Solution Approach 1:

The patent employs composite materials by combining multiple components in the encapsulant formulation. This composite approach allows tuning of the overall thermal expansion coefficient to match the semiconductor die while providing access to a broader range of material properties and performance characteristics

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies parameter changes by modifying the chemical composition and physical structure of the encapsulant material to achieve the desired thermal expansion coefficient. This allows selection from a broader range of base materials while still meeting the thermal matching requirement through compositional adjustment

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively reduces warpage and enhances the strength of semiconductor devices, improving their reliability during transfer to circuit boards by managing thermal expansion and mechanical stress through controlled encapsulation.

Implementation Method 1

reduces warpage and enhances the strength of semiconductor devices, improving their reliability during transfer to circuit boards by managing thermal expansion and mechanical stress through controlled encapsulation

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS9343427B2Manufacturing method of semiconductor device and semiconductor device manufactured thereby

Publication Date: 2016.05.17 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

A method of manufacturing a semiconductor device that can be transferred to a circuit board with improved product reliability, and a semiconductor device manufactured according to the method, are described. A non-limiting example of the manufacturing method includes preparing a wafer having multiple semiconductor die portions formed on the semiconductor wafer, performing a sawing operation to separate the multiple semiconductor die portions into multiple discrete semiconductor die, arranging the multiple discrete semiconductor die on an adhesive member, encapsulating the multiple semiconductor die using an encapsulant, and performing a second sawing operation upon the encapsulated multiple semiconductor die to produce multiple individual encapsulated semiconductor devices.