Semiconductor Die Package With Metal-Oxide Substrate Heat Dissipation
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Solution Overview
Problem
Conventional discrete semiconductor power components face challenges in efficiently dissipating heat while maintaining cost-effectiveness, as inexpensive plastic packages have poor heat conduction capabilities and ceramic packages are costly.
Innovation Solution
The integration of a metal-oxide substrate between the semiconductor die and a heat-sinking component, with conductive die clips or electrical interconnect traces, provides electrical insulation and high thermal conductivity, allowing for effective heat dissipation without increasing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional plastic packages are used for semiconductor power components, then manufacturing cost is reduced, but heat conduction capability deteriorates
Solution Approach 1:
The patent employs a composite packaging structure combining plastic material with an integrated metal heat sink. The plastic provides cost-effective encapsulation and electrical insulation, while the metal heat sink (aluminum or copper) provides high thermal conductivity for heat dissipation. This composite approach resolves the contradiction by merging the advantages of both materials: low cost from plastic and high heat conduction from metal.
2Temperature
If ceramic packages are used for semiconductor power components, then heat conduction capability is improved, but manufacturing cost increases
Solution Approach 1:
The patent creates a hybrid package that achieves ceramic-like heat conduction performance through a metal heat sink integrated with plastic packaging. The metal heat sink provides thermal pathways comparable to ceramic, while the plastic encapsulation maintains cost-effectiveness. This composite solution avoids the high cost of full ceramic packages while delivering superior heat dissipation.
3Power
If power handling capability is increased to meet industry demands, then power dissipation increases, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent merges the heat sink function directly into the package structure by integrating a metal heat sink with the plastic encapsulation. This combined heat sink-package assembly provides enhanced thermal management capability that scales with power handling requirements, allowing the package to efficiently dissipate the increased heat generated by high-power semiconductor devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables semiconductor die packages to efficiently dissipate heat while maintaining cost-effectiveness, addressing the conflicting demands of increased power handling and heat dissipation.
Implementation Method 1
the metal-oxide substrate electrically insulates the die from the heat-sinking component, and provides a path of high thermal conductivity between the die and the heat-sinking component
Implementation Method 2
heat-sinking component may comprise a heat-sink, or an adaptor plate to which a heat sink may be coupled
Data Source
AI summary
An exemplary semiconductor die package of the invention has a metal-oxide substrate disposed between a first surface of a semiconductor die and a heat-sinking component, with a conductive die clip or one or more electrical interconnect traces disposed between the metal-oxide substrate and the first surface of the semiconductor die. The heat-sinking component may comprise a heat sink, or an adaptor plate to which a heat sink may be coupled. The conductive die clip or electrical trace(s) provides electrical connection(s) to the first surface of the semiconductor die, while the metal-oxide substrate electrically insulates the die from the heat-sinking component, and provides a path of high thermal conductivity between the die and the heat-sinking component. The second surface of the semiconductor die may be left free to connect to a circuit board, or a leadframe or interconnect substrate may be attached to it.