Semiconductor Die Package Radiating Pad Thermal Stability
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Solution Overview
Problem
Conventional embedded printed circuit substrates face issues with thermal stability due to active parts like semiconductor dies generating heat, which is difficult to radiate effectively, leading to potential erroneous operation and reduced lifespan.
Innovation Solution
A semiconductor die package with a radiating pad on the bump pad surrounding the bumps, and a core substrate with a through-hole to facilitate heat dissipation, allowing for improved thermal stability by enhancing heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor dies are embedded in insulating layers, then the printed circuit substrate achieves stable operation characteristics, but heat radiation becomes difficult leading to thermal instability
Solution Approach 1:
The patent introduces a dedicated heat radiation pad as an intermediary structure between the semiconductor die and the external environment. This pad serves as a thermal mediator that facilitates heat transfer from the embedded die through the insulating layer to the exterior, resolving the contradiction between maintaining operational stability through embedding and enabling effective heat radiation.
Solution Approach 2:
The patent adds a vertical dimension to heat dissipation by creating a through-hole extending from the upper surface to the lower surface of the substrate. This dimensional change allows heat to escape in the vertical direction rather than being trapped within the planar insulating layer, thereby improving heat radiation efficiency while maintaining the embedded configuration.
2Productivity
If semiconductor dies are buried in insulating layers, then wiring length is reduced, but heat transfer to exterior or heat sink becomes difficult
Solution Approach 1:
The patent segments the substrate structure by creating a through-hole that divides the insulating layer into upper and lower portions. This segmentation creates a dedicated heat transfer pathway that is separated from the electrical wiring structure, allowing efficient heat transfer without compromising the compact wiring layout achieved through embedding.
Solution Approach 2:
The heat radiation pad acts as an intermediary structure that bridges the thermal gap created by embedding the semiconductor die in the insulating layer. This mediator enables effective heat transfer from the die to the exterior while preserving the electrical connection and compact wiring advantages of the embedded configuration.
3Area of stationary object
If conventional embedded printed circuit substrate structure is used, then minimal size is achieved, but thermal stability deteriorates due to poor heat radiation
Solution Approach 1:
The patent implements a nested structure where the heat radiation pad is integrated within the substrate layers, with the through-hole passing through multiple layers. This nesting approach allows the heat dissipation structure to be contained within the compact substrate footprint, maintaining minimal overall size while improving thermal stability through enhanced heat radiation pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves thermal stability and reduces mechanical and electrical failures by allowing efficient heat escape from the semiconductor die, ensuring stable operation and extended lifespan.
Implementation Method 1
a radiating pad formed on an upper surface of the bump pad in such a manner that the radiating pad surrounds the bumps
Implementation Method 2
a core substrate having a through-hole formed therein, the through hole extending from an upper surface of the core substrate to a lower surface of the core substrate
Data Source
AI summary
A semiconductor die package having an enhanced degree of heating radiation from the semiconductor, thereby reducing mechanical and electrical failure from excessive temperatures. A semiconductor die has circuit patterns formed thereon; a bump pad deposited on the semiconductor die and supporting at least one of the bumps electrically connected to the circuit patterns; and a radiating pad formed on an upper surface of the bump pad such that the radiating pad surrounds the bumps. An embedded printed circuit substrate includes a radiating pad formed on the bump pad to surround the bumps; and a core substrate has a through-hole formed in the core substrate, that extends from an upper surface of the core substrate to a lower surface thereof. The semiconductor die is deposited on the upper surface of the core substrate such that the bumps extend through the through-hole.