Semiconductor Die Package With Segmented Leadframe
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Solution Overview
Problem
Existing semiconductor die packages are costly to manufacture and have limitations in functionality, such as difficulty in accommodating multiple semiconductor dice and efficient thermal performance.
Innovation Solution
The development of semiconductor die packages using premolded substrates with leadframe structures and molding materials, where the leadframe structures are cut to isolate conductive portions and encapsulating materials are used to create a robust and efficient package configuration, allowing for multiple dice and improved thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional semiconductor die packages are used, then manufacturing processes are well-established, but manufacturing costs are high and functionality is limited
Solution Approach 1:
The leadframe structure is segmented into multiple isolated conductive portions by cutting the intermediate portions, allowing each conductive portion to be independently connected to semiconductor dice. This segmentation enables the package to accommodate multiple dice with different functionalities while using a standardized leadframe design, thereby reducing manufacturing costs and enhancing functionality.
Solution Approach 2:
The premolded substrate with leadframe structure serves multiple functions: it provides mechanical support, electrical connections, and thermal management. The leadframe structure can be configured to accommodate different numbers and types of semiconductor dice, making it a universal platform for various electronic applications while maintaining cost-effective manufacturing.
2Adaptability or versatility
If leadframe structures are cut to isolate conductive portions, then multiple semiconductor dice can be accommodated, but manufacturing complexity increases
Solution Approach 1:
The leadframe structure is pre-formed and premolded with all necessary conductive portions and intermediate portions before the cutting step. This preliminary action allows the subsequent cutting process to be a simple, repeatable operation that isolates conductive portions without requiring complex manufacturing steps, thereby increasing pin count while maintaining manageable manufacturing complexity.
3Adaptability or versatility
If multiple semiconductor dice are attached to the substrate, then functionality is enhanced, but thermal management becomes more challenging
Solution Approach 1:
The leadframe structure serves as an intermediary thermal management component between the multiple semiconductor dice and the external environment. The conductive portions of the leadframe are thermally coupled to the dice, providing efficient heat dissipation paths. This intermediary structure enables multiple dice to be mounted on a single substrate while maintaining effective thermal management.
Data Source
AI summary
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.