Semiconductor Die Positioning Carrier Plate for Wafer Prober
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Solution Overview
Problem
Current semiconductor device testing methods require wafers to be diced and mounted on substrates before individual die testing can occur, limiting the opportunity for early and simple quality control of single semiconductor dies.
Innovation Solution
A device comprising a carrier plate and a reversible clamp with an elastic element allows for the secure positioning of semiconductor dies in a wafer prober, enabling precise alignment and testing of detached dies within an existing wafer prober system, matching standard wafer geometry for compatibility and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wafers are diced and mounted on substrates before individual die testing, then the die can be tested after mounting, but the testing process becomes more complex and time-consuming
Solution Approach 1:
The device enables preliminary testing of semiconductor dies on the wafer before dicing and substrate mounting. By providing a carrier plate with clamp and elastic element that can securely hold individual dies or wafer segments, the system allows quality control to occur earlier in the manufacturing process, eliminating the need to wait until after substrate mounting for testing to begin
2Reliability
If wafers are diced and mounted on substrates before testing, then individual die testing can occur, but the time required for the overall process increases
Solution Approach 1:
The device performs quality control actions in advance by enabling die testing on the wafer before dicing and substrate mounting operations. This preliminary testing approach identifies defective dies early, allowing them to be excluded from subsequent processing steps, thereby reducing the total time required for the manufacturing process
Solution Approach 2:
The device extracts the testing function from the later substrate-mounted configuration and brings it forward to the wafer stage. By separating the testing operation from the substrate mounting requirement, the system allows testing to occur independently and earlier in the process flow
3Adaptability or versatility
If a carrier plate matches standard wafer geometry, then compatibility with existing wafer prober systems is improved, but the device requires additional components for die positioning
Solution Approach 1:
The carrier plate is designed with standard wafer geometry (circular shape, appropriate diameter, central aperture) that allows it to be universally compatible with existing wafer prober systems. This universal design enables the same carrier plate structure to work across different prober equipment without requiring custom modifications to the prober hardware
Solution Approach 2:
The carrier plate acts as an intermediary component that bridges the gap between individual dies and the wafer prober system. By providing a standardized interface that matches wafer geometry, the carrier plate mediates between the die positioning requirements and the prober's chuck design, enabling seamless integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables earlier and simpler testing of single semiconductor dies with precise alignment and mechanical support, reducing the risk of damage and improving testing accuracy and reliability.
Implementation Method 1
the clamp being reversibly movable against a force of an elastic element between an open position and a closed position
Data Source
AI summary
The invention relates to a device for positioning a semiconductor die in a wafer prober, the device comprising a carrier plate and a clamp on a front surface of the carrier plate, the dimensions of the carrier plate matching a standard geometry required by the wafer prober for receiving a semiconductor wafer to be probed by the wafer prober, the clamp being reversibly movable against a force of an elastic element between an open position and a closed position, the clamp being adapted for fixing the die on the carrier plate in the closed position and for releasing the die in the open position.