Semiconductor Die Release via Fluid Injection
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Solution Overview
Problem
Conventional pick and place systems face challenges in handling extremely thin semiconductor dies without breaking or damaging them during the manufacturing process, as the existing technologies are inadequate in managing the delicate handling of these small devices.
Innovation Solution
The implementation of a system that uses a release fluid, such as gaseous or liquid, to loosen the bond between the semiconductor die and the support substrate, specifically targeting the interface between the die and the dicing tape, allowing for safer removal of the die without breakage by reducing the attachment forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If conventional pick and place systems are used to handle extremely thin semiconductor dies, then the handling process can be automated, but the dies are likely to break or be damaged due to strong attachment forces
Solution Approach 1:
The system performs preliminary action by directing release fluid to the interface between the semiconductor die and support substrate before the pick operation. This weakens the attachment forces in advance, allowing the die to be released more easily during the automated pick and place process without breaking or damaging the thin die structure.
2Stability of the object's composition
If strong attachment forces are used to hold the die on the support substrate, then the die remains stable during manufacturing, but the die is difficult to remove without breaking
Solution Approach 1:
The system introduces an intermediary substance (release fluid) between the die and support substrate interface. This intermediary weakens the attachment forces by reducing adhesion, allowing the die to be easily removed from the substrate without breaking, while maintaining stability during the manufacturing process when the fluid is not applied.
3Productivity
If mechanical force is applied to remove the die from the support substrate, then the die can be transferred to the next processing station, but extremely thin dies are likely to break
Solution Approach 1:
The system replaces purely mechanical removal methods with a chemical/physical approach using release fluid. Instead of relying on mechanical force alone to detach the die from the substrate, the release fluid modifies the interface properties to reduce adhesion, enabling transfer of extremely thin dies with minimal mechanical stress and reduced breakage risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases the yield of intact semiconductor devices by reducing the likelihood of breakage during the pick and place process, particularly for extremely thin dies, thereby enhancing the efficiency and reliability of the manufacturing process.
Implementation Method 1
loosen the bond between the first semiconductor die and the support substrate
Data Source
AI summary
Systems and methods for releasing semiconductor devices during pick and place operations are disclosed. A representative system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a release station having a fluid delivery device coupleable to a source of release fluid, the fluid delivery device having an exit positioned to direct release fluid toward a semiconductor die carried by the support member at the release station.