Semiconductor Die Singulation Using Dry Etching for Irregular Shapes
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Solution Overview
Problem
Existing semiconductor die singulation methods require axial singulation lines, limiting the shape and pattern of semiconductor dies to regular shapes like squares and rectangles, which restricts wafer utilization and increases waste, as irregular shapes and patterns cannot be efficiently singulated using these methods.
Innovation Solution
A method of forming semiconductor dies with irregular shapes and patterns that do not require axial singulation lines, using a simultaneous singulation process involving dry etching to remove portions of the wafer, allowing for the creation of non-rectangular, multiply-connected, and asymmetrical dies with protrusions and curved edges, maximizing wafer area usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If axial singulation lines are used to singulate semiconductor dies, then the singulation process is simple and straightforward, but the die shape is restricted to regular shapes like squares and rectangles, reducing wafer utilization efficiency
Solution Approach 1:
The singulation process is divided into multiple steps: first forming axial singulation lines, then creating curved singulation lines to complete the irregular die shapes. This segmentation allows each type of line to serve its specific purpose without compromise
Solution Approach 2:
Axial singulation lines are formed first as preliminary structures, followed by curved singulation lines that complete the singulation process. The preliminary axial lines provide a foundation that simplifies the overall manufacturing process
2Ease of manufacture
If regular shaped dies are used with axial singulation lines, then the manufacturing process is easier, but wafer area waste increases due to inability to pack irregular shapes efficiently
Solution Approach 1:
The patent introduces asymmetry by adding curved singulation lines that create irregular die shapes, allowing dies to be packed more efficiently on the wafer surface and reducing wasted wafer area while maintaining manufacturing feasibility
Solution Approach 2:
The singulation pattern is segmented into axial and curved portions, each serving specific functions: axial lines provide straightforward manufacturing paths while curved lines optimize die packing and reduce waste
3Ease of manufacture
If straight axial singulation lines are used, then die placement follows a regular pattern, but die-to-die distance and interconnection length increase, affecting performance
Solution Approach 1:
Curved singulation lines are introduced to replace straight axial lines in certain regions, allowing die centers to be positioned closer together and reducing interconnection lengths, which improves electrical performance and signal integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of more semiconductor dies per wafer area by allowing for irregular shapes and patterns, reducing waste and improving die placement efficiency, while enabling closer proximity and shorter interconnections between dies for improved performance.
Implementation Method 1
using a dry etch to simultaneously singulate the plurality of semiconductor die
Data Source
AI summary
In one embodiment, semiconductor die having non-rectangular shapes and die having various different shapes are formed and singulated from a semiconductor wafer.