Semiconductor Die Carrier Attachment via Solder and Insulating Layers
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Solution Overview
Problem
The existing methods for attaching semiconductor chips with and without backside electrical contact pads to carriers require different non-compatible process steps and thermal load conditions, necessitating the selection of specific materials, which complicates the fabrication of electronic devices.
Innovation Solution
A method involving the application of a solder interconnect layer on semiconductor chips and an insulating layer on others, allowing for attachment to carriers with compatible thermal conditions, using a solder interconnect layer between the semiconductor die and the carrier, while ensuring the insulating layer is not covered by the solder interconnect layer at the edges to prevent leakage currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If different non-compatible process steps are used for attaching semiconductor chips with and without backside electrical contact pads, then the attachment requirements for each chip type are met, but the fabrication process complexity increases and material selection becomes more difficult
Solution Approach 1:
The patent applies universality by developing a single standardized attachment process that can handle both semiconductor chips with backside electrical contact pads and those without. The method uses a common solder interconnect layer approach for both chip types, eliminating the need for separate process sequences and material selections, thereby reducing fabrication complexity while maintaining attachment reliability for different chip configurations
Solution Approach 2:
The patent employs parameter changes by modifying the thermal load conditions and material properties of the solder interconnect layer to accommodate different chip types within a unified process. By adjusting solder composition, layer thickness, and reflow temperature parameters, the same attachment process can reliably bond both chip types to carriers without requiring fundamentally different procedures
2Ease of manufacture
If a solder interconnect layer is applied directly to the semiconductor die, then the attachment process is simplified, but leakage currents and short circuits may occur at the edges
Solution Approach 1:
The patent applies segmentation by dividing the attachment structure into functionally distinct zones: a solder interconnect layer for electrical connection in the central region, and an insulating layer for electrical isolation at the edges. This spatial segmentation allows the solder to provide low-resistance electrical paths where needed while the insulating layer prevents leakage currents at the periphery, achieving both manufacturing simplicity and electrical reliability
Solution Approach 2:
The patent implements local quality by applying different material properties to different regions of the semiconductor chip attachment interface. The solder interconnect layer provides high electrical conductivity in the contact area, while the insulating layer provides high electrical resistance at the edges. This localized differentiation of material properties ensures that each region performs its specific function optimally without compromising the other
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the efficient and compatible attachment of various semiconductor chips to carriers, reducing the risk of leakage currents and short circuits, and allows for the use of different semiconductor types in a unified fabrication process.
Implementation Method 1
a first solder interconnect layer applied to a main face of the first semiconductor die; attaching the first semiconductor chip with the first solder interconnect layer to a first carrier
Implementation Method 2
an insulating layer applied to a main face of the second semiconductor die; ensuring the insulating layer is not covered by the solder interconnect layer at the edges to prevent leakage currents
Data Source
AI summary
A method for fabricating an electronic device includes providing a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first semiconductor die and a first solder interconnect layer applied to a main face of the first semiconductor die. The second semiconductor chip has a second semiconductor die, an insulating layer applied to a main face of the second semiconductor die, and a second solder interconnect layer applied to the insulating layer. The method further includes attaching the first semiconductor chip with the first solder interconnect layer to a first carrier and attaching the second semiconductor chip with the second solder interconnect layer to a second carrier.