Semiconductor Die Imaging With Spectral Through-Focus Defect Detection
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Solution Overview
Problem
The increasing complexity and number of processes in semiconductor device manufacturing lead to defects such as skew, where patterns are misaligned, causing separation or connection issues, resulting in defective devices.
Innovation Solution
An electronic device and semiconductor manufacturing system are equipped with an imaging device that uses spectral through-focus scanning optical microscopy to capture four-dimensional images of semiconductor dies, adjusting wavelength and stage height to detect structural defects and weak areas statistically without modeling, and a verification module that analyzes these images to identify defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of manufacturing processes and complexity increase to achieve advanced semiconductor device design, then device performance and functionality improve, but defect occurrence rate increases
Solution Approach 1:
The patent performs preliminary defect detection and classification before final device completion. By using multiple detection methods (optical microscopy, SEM, TEM) and performing statistical analysis on captured images, the system identifies and classifies defects early in the manufacturing process, allowing for corrective actions before defective devices are finalized.
Solution Approach 2:
The patent implements a feedback mechanism where detected defects are analyzed statistically and used to adjust manufacturing parameters. The system captures images of defects, performs statistical analysis to identify patterns and causes, and feeds this information back to control the manufacturing process, thereby reducing defect occurrence in subsequent production cycles.
2Productivity
If optical microscopy is used for defect detection, then detection speed improves, but measurement precision for small defects deteriorates
Solution Approach 1:
The patent segments the defect detection process into multiple stages with different magnification levels. First, optical microscopy is used for rapid screening of large areas to identify potential defects. Then, for suspected defect regions, higher magnification methods (SEM, TEM) are applied to confirm and precisely characterize small defects. This segmented approach maintains both speed and precision.
Solution Approach 2:
The patent transitions from two-dimensional optical microscopy to three-dimensional analysis by incorporating focus stacking and multiple focal plane imaging. This allows the system to detect defects at different depths and layers, improving precision for small defects while maintaining detection speed through automated multi-plane scanning.
3Reliability
If statistical analysis of captured images is performed to detect defects, then detection reliability improves, but processing time increases
Solution Approach 1:
The patent applies partial statistical analysis by first performing rapid filtering on captured images to identify regions containing potential defects. Full statistical analysis is then applied only to these regions of interest rather than entire images. This selective approach maintains high detection reliability while significantly reducing overall processing time.
Solution Approach 2:
The patent performs preliminary image preprocessing and feature extraction before full statistical analysis. By pre-processing images to enhance defect features and remove noise, the system reduces the computational burden of subsequent statistical analysis, thereby maintaining reliability while reducing processing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables rapid and reliable detection of defects across the entire wafer by comparing statistical characteristics of normal and defective dies, improving the manufacturing process by identifying and addressing weak areas effectively.
Implementation Method 1
generating light of a selected wavelength within the first wavelength range by filtering the white light using a monochromater of the electronic device
Implementation Method 2
capturing reflection light reflected from the semiconductor device using a camera of the electronic device
Data Source
AI summary
A method of operating an electronic device that is configured to support manufacturing a semiconductor device includes (i) selecting a height of a stage of the electronic device that is configured to hold the semiconductor device, (ii) generating white light by using a light source of the electronic device, (iii) generating light of a selected wavelength by filtering the white light using a monochromater of the electronic device, (iv) emitting the light of the selected wavelength to the semiconductor device using a beam splitter of the electronic device, and (v) capturing reflection light reflected from the semiconductor device using a camera of the electronic device.