Mould-Encapsulated Semiconductor Die Thinning Against Warpage
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Solution Overview
Problem
Semiconductor wafers and dies face issues of warpage and breakage due to thinning, which increases electrical resistance and reduces mechanical strength, and existing solutions like Taiko rings do not fully mitigate these problems.
Innovation Solution
A method involving the encapsulation of semiconductor dies within a moulding compound to provide mechanical strength during thinning, allowing for reduced thickness without warpage or breakage, using processes like grinding or polishing, and incorporating a base frame and clip for additional support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the die is thinned to reduce electrical resistance, then electrical resistance decreases, but mechanical strength is reduced causing warpage and breakage
Solution Approach 1:
The die is encapsulated in moulding compound before the thinning process. This preliminary encapsulation provides mechanical support during subsequent thinning operations, preventing warpage and breakage while allowing the die to be thinned to the desired thickness for optimal electrical performance
Solution Approach 2:
The moulding compound acts as an intermediary that provides mechanical strength to the die during processing. The compound supports the fragile thinned die, enabling handling and assembly operations that would otherwise be impossible due to the die's reduced mechanical strength
2Length of moving object
If the wafer is thinned to reduce thickness, then die thickness decreases, but warpage increases due to loss of mechanical strength
Solution Approach 1:
Encapsulation is performed before thinning to establish mechanical support in advance. This prevents the wafer from warping during the thinning process itself, as the moulding compound compensates for the loss of structural integrity
Solution Approach 2:
The physical state and mechanical properties of the die are changed by embedding it in moulding compound. This alters the overall structural parameters, allowing the thin die to maintain stability through the composite structure rather than relying on the die's own mechanical strength
3Reliability
If the die is thinned to minimal thickness, then electrical resistance is reduced, but handling difficulty increases due to fragility
Solution Approach 1:
The moulding compound serves as a mediator that enables easy handling of the fragile thinned die. All handling operations are performed on the encapsulated unit, where the compound provides the mechanical strength needed for manipulation, transport, and assembly
Solution Approach 2:
The die is encapsulated before any handling operations. This preliminary encapsulation creates a robust handling interface, allowing subsequent assembly and manipulation steps to be performed on a stable, mechanically strong package rather than on the fragile die alone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables thinning of semiconductor dies to minimal thickness while maintaining mechanical strength, reducing electrical resistance and preventing warpage and breakage, making the dies more handleable and suitable for integration into electronic circuits.
Implementation Method 1
Because the die is encapsulated within a moulding compound, this provides mechanical strength to the die during thinning
Implementation Method 2
This may comprise abrading the die. Suitable abrasion processes for this purpose include grinding and/or polishing
Data Source
AI summary
There is provided a method of manufacturing a manufacturing intermediate for a semiconductor package, the method including: providing a die; at least partially encapsulating the die within a moulding compound; and thinning the die. There is further provided a manufacturing intermediate for a semiconductor package, including: a die having a first surface and a second surface; and a moulding encapsulating the die; in which the first surface of the die is exposed.