Semiconductor Dielectric Layer Adhesion via Chemical Additive
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Solution Overview
Problem
Current three-dimensional integration technologies for semiconductor packaging face challenges such as solder residue and delamination of the dielectric layer from the connector, which affect the integrity and performance of the package.
Innovation Solution
Incorporating a dielectric layer with a specific additive, represented by Chemical Formula 1, that enhances the adhesion between the dielectric material and the connector, preventing the formation of solder residue and delamination by improving the interface bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional three-dimensional integration technology is used for semiconductor packaging, then size reduction and high performance interconnects can be achieved, but solder residue and delamination of the dielectric layer from the connector occur
Solution Approach 1:
An adhesion promoter layer is introduced as an intermediary between the dielectric layer and the connector. This intermediate layer specifically addresses the delamination issue by providing enhanced bonding interfaces, allowing the dielectric layer to adhere properly to the connector while maintaining the overall package integrity and preventing harmful factors like solder residue formation.
Solution Approach 2:
The invention modifies the chemical composition parameters of the dielectric layer by incorporating specific adhesion promoters and adjusting material ratios. These parameter changes in the dielectric material formulation improve interfacial bonding strength and prevent delamination, while also controlling solder residue formation through optimized material properties.
2Ease of manufacture
If the dielectric layer is formed without adhesion promoter, then the manufacturing process is simpler, but delamination occurs between the dielectric layer and connector
Solution Approach 1:
The adhesion promoter acts as a mediating substance that is integrated into the dielectric layer formulation. This intermediary component specifically targets the interface between the dielectric layer and connector, providing chemical bonding mechanisms that enhance adhesion without significantly complicating the manufacturing process, as it can be applied during the existing dielectric layer formation steps.
Solution Approach 2:
The dielectric layer is formulated as a composite material containing the base dielectric material combined with adhesion promoter additives. This composite structure maintains the electrical insulation properties of the dielectric while incorporating bonding-enhancing components that prevent delamination, achieving both manufacturing feasibility and improved interface strength.
3Reliability
If adhesion promoter is added to the dielectric layer, then delamination is prevented, but the dielectric layer composition becomes more complex
Solution Approach 1:
The invention optimizes the concentration parameters of adhesion promoters within the dielectric layer to achieve effective adhesion with minimal additive amounts. By carefully controlling the composition parameters and using small percentages of adhesion promoter materials, the dielectric layer maintains its primary functionality while achieving sufficient bonding strength without excessive complexity.
Solution Approach 2:
The adhesion promoter is strategically concentrated at the interface regions between the dielectric layer and connector, rather than uniformly distributed throughout the entire dielectric layer. This localized quality enhancement provides maximum adhesion benefit at the critical bonding interfaces while minimizing the overall complexity and material composition changes in the bulk dielectric layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces solder residue formation and delamination, enhancing the electrical connection and overall performance of the semiconductor package by maintaining the integrity of the dielectric layer and intermetallic compound interface.
Implementation Method 1
the additive includes a compound represented by Chemical Formula 1... enhances the adhesion between the dielectric material and the connector... improving the interface bonding strength
Data Source
AI summary
A semiconductor device includes a dielectric layer and a conductive structure in the dielectric layer. The dielectric layer includes a dielectric material and a compound represented by Chemical Formula 1. In Chemical Formula 1, R is the same as defined in the specification.