Semiconductor Dielectric Stack Voltage Divider

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Solution Overview

Problem

Semiconductor elements with a dielectric layer stack face issues due to interfacial charging, leading to undesirable inversion or accumulation layers, increased leakage currents, short circuits, and reduced flashover voltage.

Innovation Solution

A semiconductor component design featuring a dielectric layer stack with a second conductive layer electrically connected to a voltage divider, which prevents charge accumulation by dissipating charges through the conductive layer and voltage divider, maintaining the conductive layer at a constant potential.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a dielectric layer stack is used between the semiconductor body and the conductive layer, then the electrical insulation is improved, but interfacial charges accumulate at the interface between dielectric layers causing leakage currents and short circuits

Engineering Contradiction:
Improveelectrical insulationVSAvoidinterfacial charges
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

A second conductive layer is introduced as an intermediary between the first and second dielectric layers. This conductive layer acts as a charge sink that captures and dissipates interfacial charges before they can accumulate and cause harmful effects, thereby maintaining electrical insulation while eliminating charge accumulation problems

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The electrical conductivity parameter is changed at the interface between dielectric layers by introducing a conductive layer. This changes the electrical characteristics of the interface from insulating (where charges would accumulate) to conductive (where charges are dissipated), resolving the contradiction between insulation and charge accumulation

Inventive Principle:
Principle #35Parameter changes

2Reliability

If different dielectric materials are used in the dielectric layer stack, then the dielectric properties are optimized, but charge accumulation occurs more readily at the interfaces between different dielectric materials

Engineering Contradiction:
Improvedielectric propertiesVSAvoidinterfacial charges
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The second conductive layer serves as a mediator between different dielectric materials with different properties. It prevents direct contact between the dielectric interfaces, thereby eliminating the formation of charge accumulation zones while still allowing each dielectric layer to maintain its optimized properties

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively eliminates interfacial charges between dielectric layers, reducing leakage currents and maintaining optimal voltage conditions, thereby enhancing the reliability and performance of semiconductor components.

Implementation Method 1

The charges penetrating through these dielectrics are dissipated via the second electrically conductive layer and the voltage divider

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

The semiconductor component furthermore has a voltage divider, which is switched between the first conductive layer and the semiconductor body zone. The second electrically conductive layer always remains at the same potential

Methodology Applied
Scientific EffectVoltage division: Electrical Resistance

Data Source

PatentUS9786659B2Semiconductor component with dielectric layer stack and voltage divider
Publication Date: 2017.10.10 INFINEON TECH AUSTRIA AG
  • US9786659B2 patent drawing
  • US9786659B2 patent drawing
  • US9786659B2 patent drawing

AI summary

A semiconductor component has a semiconductor body zone, a first electrically conductive layer adjacent to the semiconductor body zone, a first dielectric layer with first dielectric properties and a second dielectric layer with second dielectric properties. The first dielectric properties differ from the second dielectric properties. The first dielectric layer and the second dielectric layer are arranged between the semiconductor body zone and the first electrically conductive layer. A second electrically conductive layer is applied between the first dielectric layer and the second dielectric layer. A first voltage divider is switched between the first electrically conductive layer and the semiconductor body zone. The second electrically conductive layer is electrically conductively connected only to the voltage divider.