Direct Transfer of Semiconductor Dies to Reduce Device Thickness
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Solution Overview
Problem
Conventional semiconductor device fabrication processes result in packaged devices that are significantly larger and thicker than the unpackaged dies, limiting the thickness and efficiency of the final product due to the packaging requirements, and existing transfer methods are inefficient and costly.
Innovation Solution
A direct transfer apparatus and method that aligns and affixes unpackaged semiconductor device dies from a wafer tape to a product substrate without packaging, using a transfer mechanism with a needle to separate the dies from the wafer tape and a fixing mechanism with energy emission to secure them to the substrate, allowing for precise alignment and reduced material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional packaging process is used, then semiconductor devices are protected from environment, but the devices become significantly larger and thicker
Solution Approach 1:
The patent extracts the protective function from the traditional packaging structure and applies it selectively only to the die surface that requires protection, rather than enclosing the entire die in a bulky package. This allows the device to maintain environmental protection while dramatically reducing overall thickness.
Solution Approach 2:
Instead of uniformly packaging the entire die, the invention applies protective features only to specific local areas of the die surface that require protection. This localized approach maintains necessary protection while minimizing the volume increase associated with conventional packaging.
2Ease of manufacture
If conventional pick and place process is used, then dies are sorted and packaged, but manufacturing time and cost increase
Solution Approach 1:
The patent combines multiple separate manufacturing steps (die separation, transfer, and placement) into a single integrated direct transfer process. This merging of operations eliminates intermediate handling steps, reducing both manufacturing time and cost while maintaining the ability to sort and place dies correctly.
Solution Approach 2:
The invention performs die separation and transfer in a preliminary integrated step before final placement, preparing the die for immediate mounting on the substrate. This preliminary action eliminates the need for subsequent pick-and-place operations, streamlining the manufacturing process.
3Ease of operation
If packaged devices are used, then devices are ready to be plugged in, but the circuit assembly cannot be thinner than the packaging
Solution Approach 1:
The patent extracts the essential protective and functional features from the traditional package and integrates them directly onto the die surface, eliminating the need for a separate package body. This allows the circuit assembly to be as thin as the die itself while maintaining plug-and-play capability.
Solution Approach 2:
The invention transitions from three-dimensional packaging to a two-dimensional surface-based approach, where protective and interconnection features are formed on the die surface rather than enclosing the die in a volumetric package. This dimensional change enables extreme thinness while maintaining functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the thickness of the final product, decreases manufacturing time and cost, and enables more efficient use of semiconductor dies by eliminating unnecessary packaging, resulting in a thinner and more compact semiconductor device.
Implementation Method 1
a transfer mechanism with a needle to separate the dies from the wafer tape
Implementation Method 2
a fixing mechanism with energy emission to secure them to the substrate
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
An apparatus including components to stack semiconductor device die.