Semiconductor IC Temperature Detection Using Differential Amplifier Noise Cancellation
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Solution Overview
Problem
Semiconductor integrated circuits with built-in temperature sensors face significant accuracy issues due to noise interference from system boards, particularly in car navigation systems, leading to thermal runaway and performance degradation.
Innovation Solution
A semiconductor integrated circuit design that incorporates a temperature detection circuit and a functional module with a differential amplifier circuit to cancel out noise, allowing for precise temperature monitoring and control with minimal influence from system board noise, using a temperature detection signal and a reference signal with differential amplifier circuits to manage the operating ratio and power supply of the CPU.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a built-in temperature detection circuit is used to monitor chip temperature, then temperature control capability is improved, but measurement precision deteriorates due to noise interference from system board
Solution Approach 1:
The patent introduces a differential amplifier circuit as an intermediary between the temperature detection circuit and the external environment. This intermediary structure amplifies the temperature detection signal while simultaneously suppressing common-mode noise from the system board, thereby resolving the contradiction between maintaining temperature control capability and achieving accurate temperature measurement in noisy environments
Solution Approach 2:
The patent implements a feedback mechanism where the temperature detection signal is continuously monitored and fed back through the differential amplifier circuit. This feedback loop allows the system to dynamically adjust and compensate for noise interference, maintaining measurement precision while preserving the built-in temperature control functionality
2Productivity
If a functional module with large operating current is used, then productivity is improved, but object-generated harmful factors worsen due to thermal runaway risk
Solution Approach 1:
The patent employs a feedback control mechanism where the temperature detection circuit continuously monitors chip temperature and feeds this information back to control the operational state of the functional module. When temperature exceeds predetermined thresholds, the system automatically reduces operating current or shuts down the functional module, preventing thermal runaway while allowing high productivity during normal operation
Solution Approach 2:
The temperature detection circuit and control mechanism operate autonomously within the semiconductor integrated circuit, automatically detecting temperature conditions and adjusting the functional module's operation without external intervention. This self-service capability enables the system to prevent thermal runaway while maintaining high productivity through intelligent, real-time power management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and safe temperature control, preventing thermal runaway and maintaining system performance by effectively canceling noise interference and managing the chip's operating conditions.
Implementation Method 1
a differential amplifier circuit to cancel out noise, allowing for precise temperature monitoring and control
Data Source
AI summary
The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit.