Semiconductor Element with Integrated Diffusion Barrier Frame
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Solution Overview
Problem
The construction of thermoelectric modules is complex and costly due to the precise assembly of individual components, which requires precise matching of tolerances and adequate heat transfer and electrical contacting, and existing semiconductor elements are prone to contamination and functional failure from diffusion of material through electrically conducting bridges.
Innovation Solution
A semiconductor element comprising a thermoelectric material connected force-lockingly to a first frame part that serves as both a diffusion barrier and an electric conductor, allowing for a simple and economical construction of thermoelectric modules, where the frame parts are connected in a force-locking and partially form-locking manner to ensure effective thermal energy conversion into electric energy without contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a diffusion barrier is disposed between the electrically conducting bridges and the thermoelectric material to prevent material diffusion, then the reliability of the semiconductor element is improved, but the device complexity increases due to the additional component and precise assembly requirements
Solution Approach 1:
The patent combines the diffusion barrier layer with the electrically conducting bridge by applying the diffusion barrier material directly onto the bridge structure. This integration eliminates the need for a separate diffusion barrier component, reducing assembly steps and tolerance matching requirements while maintaining the protective function against material diffusion between the bridge and thermoelectric material.
Solution Approach 2:
The electrically conducting bridge is designed to serve multiple functions: it provides electrical conduction, acts as a structural support element, and simultaneously serves as the diffusion barrier when coated with the appropriate material layer. This multi-functionality reduces the total number of components needed in the thermoelectric module assembly.
2Manufacturing precision
If individual components are assembled to form a thermoelectric module with precise matching of tolerances, then the heat transfer and electrical contacting are improved, but the manufacturing cost and complexity increase
Solution Approach 1:
The patent integrates multiple functions into fewer components, such as combining the diffusion barrier with the electrically conducting bridge. This reduction in component count directly reduces the number of assembly operations and tolerance matching requirements, thereby simplifying manufacturing while maintaining thermal and electrical performance.
Solution Approach 2:
The diffusion barrier material is applied to the electrically conducting bridge in advance during the bridge fabrication process, rather than being added as a separate component during module assembly. This preliminary action ensures proper material deposition and bonding while eliminating subsequent assembly steps that would require precise tolerance matching.
3Reliability
If the semiconductor element construction uses separate diffusion barrier and electrically conducting bridge components, then the diffusion protection is ensured, but the production simplicity is reduced
Solution Approach 1:
The patent merges the diffusion barrier layer with the electrically conducting bridge structure by depositing the barrier material directly onto the bridge. This integrated approach maintains the diffusion protection function while significantly simplifying the production process by eliminating the need to handle and assemble separate barrier components.
Solution Approach 2:
The electrically conducting bridge is constructed as a composite structure with a base bridge material providing electrical conduction and a coating layer of diffusion barrier material providing protection. This composite construction achieves both functional requirements in a single integrated component that can be manufactured in one process sequence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the production of thermoelectric modules by integrating the frame parts directly with the semiconductor elements, preventing material diffusion and ensuring effective heat and electric current transfer, thereby enhancing the reliability and efficiency of the thermoelectric conversion process.
Implementation Method 1
The nature of thermoelectric materials is such that they can convert thermal energy into electric energy in an effective manner (Seebeck effect)
Implementation Method 2
The nature of thermoelectric materials is such that they can convert thermal energy into electric energy in an effective manner (Seebeck effect) and vice versa (Peltier effect)
Implementation Method 3
a diffusion barrier is generally disposed between the electrically conducting bridges and the thermoelectric material, preventing diffusion of material contained in the electric bridges into the thermoelectric material
Data Source
AI summary
A semiconductor element includes at least a thermoelectric material and a first frame part which are force-lockingly connected to one another, with the frame part forming a diffusion barrier for the thermoelectric material and an electrical conductor. A method for producing the semiconductor element as well as a thermoelectric module having at least two semiconductor elements, are also provided.