Semiconductor Diode Current Distribution via Dummy Trenches
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Solution Overview
Problem
Conventional semiconductor devices with integrated IGBT and FWD sections face issues with current concentration at the end portion of the diode section due to the N+-type cathode region being provided across the entire lower portion, leading to inefficient current flow and potential electric field concentration.
Innovation Solution
The semiconductor device design includes a diode section with a second conductivity-type anode region, a first conductivity-type drift region, a first conductivity-type cathode region, dummy trench portions, and a contact portion, where the dummy trench portions are arrayed differently from the gate trench portions, and the cathode region is scaled down, with a collector region extending further to alleviate current concentration and electric field stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If an N+-type cathode region is provided in the entire lower portion of the diode section, then the diode section can be formed with a simple structure, but currents flowing from the lower surface of the chip toward its upper surface are concentrated at an end portion of the diode section
Solution Approach 1:
The patent applies local quality by providing the N+-type cathode region only in a specific region below the drift region rather than across the entire lower portion. This localized approach creates different electrical properties in different areas: the region with the cathode region has high carrier concentration for efficient current collection, while other regions maintain lower concentration to prevent current concentration at end portions. This resolves the contradiction by achieving good current distribution without requiring complex overall restructuring.
2Ease of manufacture
If an N+-type cathode region is provided in the entire lower portion of the diode section, then the manufacturing process is simplified, but electric field concentration occurs at the end portion of the contact portion
Solution Approach 1:
The patent uses local quality by restricting the N+-type cathode region to a specific area below the drift region rather than the entire lower portion. This creates localized high-carrier-concentration zones that provide good electrical contact where needed, while other areas maintain lower concentration to distribute the electric field more evenly. This approach maintains manufacturing simplicity while eliminating the harmful electric field concentration effect.
3Reliability
If the cathode region is scaled down and collector region extended, then current concentration is reduced and reverse recovery withstand capability is enhanced, but the device structure becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the lower portion of the diode section into distinct functional regions: a specific region below the drift region containing the N+-type cathode region, and other regions with different doping characteristics. This segmentation allows each region to be optimized for its specific function - the cathode region for efficient current collection and other regions for electric field management - achieving enhanced reverse recovery capability through a systematically divided structure rather than a monolithic complex design.
Data Source
AI summary
A semiconductor device is provided, including: a semiconductor substrate; a transistor section provided in the semiconductor substrate; and a diode section provided in the semiconductor substrate being adjacent to the transistor section, wherein the diode section includes: a second conductivity-type anode region; a first conductivity-type drift region; a first conductivity-type cathode region; a plurality of dummy trench portions arrayed along a predetermined array direction; a contact portion provided along an extending direction of the plurality of dummy trench portions that is different from the array direction; and a lower-surface side semiconductor region provided directly below a portion of the contact portion at an outer end in the extending direction.


