Semiconductor Package Discharge Gap Layout for Overvoltage Protection
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Solution Overview
Problem
Existing semiconductor devices struggle to reliably prevent the breakdown of semiconductor elements due to overvoltages exceeding design assumptions, as the gap between discharge terminals varies among devices, leading to fluctuating discharge voltages and insufficient suppression of surge voltages.
Innovation Solution
A semiconductor device design featuring a circuit board with semiconductor elements, a case with conductive terminals, and a discharge wiring board with conductive patterns facing each other across a controlled gap, ensuring discharge occurs at a set voltage to prevent overvoltage-induced breakdowns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discharge terminals are designed with a gap to enable discharge protection, then overvoltage protection capability is improved, but the gap variation among individual devices causes discharge voltage fluctuation and reduces reliability
Solution Approach 1:
The invention changes the gap parameter from a fixed physical distance to a controllable electrical characteristic by introducing a discharge wiring board with conductive patterns. The gap is replaced with a controlled impedance path that maintains consistent discharge voltage across devices despite variations in physical dimensions.
Solution Approach 2:
The discharge wiring board acts as an intermediary between the discharge terminals and the semiconductor element. It provides a controlled discharge path through conductive patterns that stabilize the discharge voltage, preventing direct reliance on the physical gap between terminals which varies among devices.
2Object-affected harmful factors
If parasitic inductance is reduced and parasitic capacitance is increased to suppress surge voltage, then surge voltage suppression is improved, but the effect is insufficient against overvoltage exceeding design assumptions
Solution Approach 1:
The invention implements preliminary discharge action through the discharge wiring board before extreme overvoltage can damage the semiconductor element. The controlled discharge path is pre-established through the conductive patterns, enabling immediate discharge protection when overvoltage occurs, rather than relying solely on passive parasitic parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively stabilizes the discharge voltage across devices, reliably preventing semiconductor element breakdowns even under overvoltage conditions, thus enhancing the reliability of power conversion devices.
Implementation Method 1
the discharge portion of the first conductive terminal and the discharge portion of the second conductive terminal protrude to a position away from other members and face each other via a gas
Data Source
AI summary
A semiconductor device, having: a circuit board, including a wiring board and a semiconductor element disposed on a first surface of the wiring board; a case having a hollow portion housing the circuit board; and a first conductive terminal and a second conductive terminal attached to the case, each of the first conductive terminal and the second conductive terminal having an inner connection portion exposed to the hollow portion of the case. The inner connection portions have a first gap therebetween in the hollow portion of the case. The first conductive terminal and the second conductive terminal each have a discharge portion facing each other across a second gap narrower than the first gap. The discharge portion of the first conductive terminal and the discharge portion of the second conductive terminal protrude to a position away from other members.