Semiconductor Device with Discrete Temperature Sensor for Timing Stability
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Solution Overview
Problem
Semiconductor devices with integrated oscillators face challenges in maintaining accurate timing signals due to temperature fluctuations, as existing solutions often rely on built-in temperature sensing devices that are affected by heat from the semiconductor chip, leading to inaccurate frequency corrections and increased component costs.
Innovation Solution
A semiconductor device configuration that includes a separate temperature sensing device and capacitors, both discrete from the semiconductor chip, which allows for precise temperature measurement and frequency correction of the oscillator, reducing heat interference and enabling more accurate timing signals across varying temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a built-in temperature sensing device is used within the semiconductor chip, then the device complexity is reduced, but the temperature measurement precision deteriorates due to heat interference from the semiconductor chip
Solution Approach 1:
The temperature sensing function is segmented from the semiconductor chip into a separate discrete temperature sensing device. This physical separation allows the temperature sensor to measure the oscillator's temperature without being affected by the heat generated from the semiconductor chip, thereby improving temperature measurement precision while maintaining reasonable device complexity.
Solution Approach 2:
The temperature sensing device is extracted from the semiconductor chip structure and provided as a separate discrete component. This extraction eliminates the heat interference problem that would occur with a built-in sensor, enabling accurate temperature measurement for frequency correction without compromising the semiconductor chip's thermal environment.
2Measurement precision
If a separate temperature sensing device is used, then the temperature measurement precision is improved, but the device complexity increases
Solution Approach 1:
The separate temperature sensing device is combined with the semiconductor chip and oscillator within a single package structure. This integration approach improves temperature measurement precision by physically separating the sensor from the chip's heat source, while minimizing device complexity by housing all components in one compact package rather than requiring multiple separate components.
3Device complexity
If frequency correction is not performed, then the device complexity is reduced, but the timing signal stability deteriorates under temperature fluctuations
Solution Approach 1:
A feedback mechanism is implemented where the temperature sensing device continuously monitors the temperature of the oscillator, and the frequency correction section adjusts the oscillation frequency based on the detected temperature. This closed-loop feedback system ensures timing signal stability under temperature fluctuations while maintaining reasonable device complexity through efficient temperature-compensation algorithms.
Solution Approach 2:
The oscillation frequency parameter is dynamically changed based on temperature measurements to compensate for thermal effects. The frequency correction section modifies the oscillator's operating frequency in response to temperature variations, thereby maintaining timing signal stability without requiring overly complex temperature control mechanisms.
4Measurement precision
If multiple discrete components are used for temperature sensing and frequency correction, then the measurement precision is improved, but the manufacturing cost increases
Solution Approach 1:
The semiconductor chip is designed with multi-functionality, integrating the oscillator, frequency correction section, and timer circuit within a single chip. This universal design approach improves frequency measurement precision through accurate temperature compensation, while reducing manufacturing cost by minimizing the number of discrete components that need to be assembled and tested.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-precision timing measurements by accurately correcting frequency errors caused by temperature changes, reducing component costs and improving the stability of timing signals in semiconductor devices.
Implementation Method 1
a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section
Implementation Method 2
an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator
Implementation Method 3
the oscillation circuit includes a piezoelectric element and a resonator
Data Source
AI summary
A semiconductor device includes: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that generates a timing signal of a frequency according to a oscillation frequency of the oscillation circuit, and a frequency correction section that corrects a frequency of the timing signal based on temperature data; and a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section, and that is provided as a separate body to the semiconductor chip, or a capacitor that is electrically connected to both the oscillator and the oscillation circuit and that is provided as a separate body to the semiconductor chip, wherein the oscillator, the semiconductor chip and the discrete device are contained within a single package.