Docking Plate Removal Handle for Semiconductor Equipment

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Solution Overview

Problem

The existing methods for removing docking plates in semiconductor equipment are time-consuming, prone to damage, and disrupt continuous wafer production, requiring significant downtime and costly replacements.

Innovation Solution

A docking plate combination featuring a handle with a separating mechanism, pivotally connected to the docking plate base device through pedestals and struts, allowing for efficient and damage-free removal by applying a pull force, reducing maintenance time and costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of time

If traditional hammer method is used to remove docking plate, then removal can be achieved, but significant time is consumed and damage to docking plate occurs

Engineering Contradiction:

Improveremoval timeVSAvoiddocking plate integrity

Core Design Contradiction:

Loss of timeVSReliability

Solution Approach 1:

A handle assembly is introduced as an intermediary tool between the operator and the docking plate. The handle connects to the docking plate through pedestals and struts, allowing force to be applied in a controlled manner that leverages mechanical advantage to remove the tightly attached docking plate without direct impact damage

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The handle assembly incorporates a pivotal connection mechanism that allows dynamic movement during the removal process. The handle can pivot and rotate to accommodate the force application needs, transforming static hammering into a dynamic leveraging action that reduces both time and damage risk

Inventive Principle:

Principle #15Dynamics

2Force

If repeated hammering is applied to remove tightly attached docking plate, then removal force is sufficient, but docking plate damage and replacement costs increase

Engineering Contradiction:

Improveremoval forceVSAvoiddocking plate replacement cost

Core Design Contradiction:

ForceVSEase of manufacture

Solution Approach 1:

The handle assembly transforms the application of force from repeated impact (hammering) to sustained leveraged force. The pivotal connection allows the handle to rotate and apply force efficiently, achieving the necessary removal force without the damaging repeated blows that lead to docking plate failure

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The handle assembly acts as a force-multiplying intermediary between the operator and the docking plate. Through its lever arm and pivotal connection, it amplifies the applied force in a controlled manner, sufficient to overcome the tight attachment without the need for excessive force that would damage the expensive docking plate

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of operation

If equipment is stopped for docking plate removal, then cleaning and maintenance can be performed, but continuous wafer production is interrupted

Engineering Contradiction:

Improvemaintenance accessibilityVSAvoidwafer production continuity

Core Design Contradiction:

Ease of operationVSProductivity

Solution Approach 1:

The handle assembly is designed to be attached to the docking plate before removal, preparing the mechanism in advance. This preliminary configuration allows for quick engagement and rapid removal, minimizing the equipment downtime needed for maintenance while ensuring proper alignment and force application

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS8919757B2Apparatus for removal of docking plate in semiconductor equipment

Publication Date: 2014.12.30 MACRONIX INTERNATIONAL CO LTD

AI summary

The present invention relates to an apparatus for removal of docking plate, wherein comprising a docking plate base device; and a handle removably joined to the docking plate base device and causing the docking plate base device to be removed from the semiconductor equipment when the handle is joined to the docking plate base device.