Semiconductor Device Donut-Shaped Interconnect Routing
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Solution Overview
Problem
The manufacturing of semiconductor devices faces challenges due to undesired configurations of integrated components with varying thermal properties, leading to yield loss, poor bondability, and increased costs, exacerbated by the complexity of assembly and material wastage.
Innovation Solution
The implementation of donut-shaped or C-shaped interconnects for routing area reduction and improved routing capability, with conductive traces lining recesses in composite dielectric structures, allowing for better electrical connections and reduced material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional interconnect routing structures are used, then routing capability is limited, but routing area increases and material usage increases
Solution Approach 1:
The patent employs donut-shaped and C-shaped interconnect structures that utilize curved geometries to achieve efficient routing. The donut-shaped interconnect (ring structure) and C-shaped interconnect (arch structure) allow electrical connections to route around obstacles and across die boundaries without requiring additional planar space, thereby improving routing capability while minimizing routing area occupation.
Solution Approach 2:
The invention transitions from conventional planar (2D) routing to three-dimensional (3D) routing by stacking multiple interconnect layers vertically. The donut-shaped and C-shaped structures are positioned at different heights (first and second heights) relative to the semiconductor device, enabling routing paths to utilize the vertical dimension to avoid obstacles and reduce lateral routing area requirements.
2Adaptability or versatility
If more components with different materials are involved, then functionality increases, but manufacturing complexity increases
Solution Approach 1:
The patent divides the interconnect system into distinct modular components: donut-shaped interconnects, C-shaped interconnects, and conventional linear interconnects. Each type serves specific routing functions and can be independently designed, manufactured, and assembled. This segmentation allows for standardized manufacturing processes for each component type while achieving complex overall functionality through their combination.
Solution Approach 2:
The donut-shaped and C-shaped interconnects are designed as universal routing solutions that can perform multiple functions: routing signals within a die, connecting adjacent dies, and providing electrical connections across various obstacles. These multi-functional interconnect structures reduce the need for different specialized components, thereby simplifying manufacturing despite increased device functionality.
3Ease of manufacture
If conventional linear interconnects are used, then manufacturing is simple, but routing capability around obstacles is limited
Solution Approach 1:
The patent introduces curved interconnect structures (donut-shaped and C-shaped) that can naturally route around obstacles such as vias, trenches, and other features. These curved geometries are manufactured using standard photolithography and deposition processes, maintaining manufacturing simplicity while dramatically improving routing capability around obstacles compared to linear interconnects.
Data Source
AI summary
A semiconductor device includes a semiconductor substrate, a conductive pad on the semiconductor substrate, and a first dielectric over the semiconductor substrate. The semiconductor device also includes a conductive layer disposed in the first dielectric and a second dielectric disposed on the conductive layer. In the semiconductor device, at least a portion of the conductive layer is exposed from the first dielectric and second dielectric. The semiconductor device further includes a conductive trace partially over the second dielectric and in contact with the exposed portion of the conductive layer. In the semiconductor device, the conductive trace is connected to the conductive pad at one end.