Semiconductor Doping Layout for Low-Cost Electrical Performance

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Solution Overview

Problem

The challenge is to provide a semiconductor device at a low cost while maintaining effective electrical characteristics.

Innovation Solution

A semiconductor device is designed with a semiconductor substrate that includes an N-type region with a specific acceptor concentration ratio to the carrier concentration, allowing for efficient manufacturing through a method involving donor implantation and heat treatment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a high donor concentration is introduced into the N-type region to improve electrical characteristics, then the electrical performance is enhanced, but the bulk-acceptor concentration also increases which degrades the electrical characteristics

Engineering Contradiction:
Improveelectrical characteristicsVSAvoidbulk-acceptor concentration
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent divides the semiconductor substrate into distinct regions with different doping characteristics: an N-type region with high donor concentration for good electrical performance, and a P-type region with acceptor concentration controlled at 0.001-0.1 times the donor concentration to minimize bulk-acceptor effects. This spatial segmentation allows each region to optimize its electrical properties independently.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by creating a non-uniform doping distribution where the N-type region has high donor concentration (1.0×10^15 to 1.0×10^18 atoms/cm³) for excellent electrical characteristics, while the P-type region maintains very low acceptor concentration (0.001-0.1 times the donor concentration) to prevent bulk-acceptor degradation. This localized optimization resolves the contradiction between improving electrical characteristics and controlling bulk-acceptor concentration.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If conventional doping methods are used to create N-type regions, then manufacturing is simpler, but achieving high donor concentration without increasing bulk-acceptor concentration is difficult

Engineering Contradiction:
Improvedoping processVSAvoiddonor concentration control
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent employs preliminary action by first forming the P-type region with controlled acceptor concentration, then subsequently introducing donors into the N-type region. This sequential approach allows precise control of donor concentration (1.0×10^15 to 1.0×10^18 atoms/cm³) without being constrained by the acceptor concentration, achieving high manufacturing precision while maintaining ease of manufacture through standard multi-step doping processes.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of semiconductor devices with improved electrical characteristics while reducing production costs, specifically by achieving a high donor concentration in the N-type region without significantly increasing the bulk-acceptor concentration.

Implementation Method 1

a first inverting step configured to form an N-type region including a center position in a depth direction of a semiconductor substrate by implanting a donor into the P-type semiconductor substrate

Methodology Applied
Scientific EffectIon implantation: Ion Implantation

Implementation Method 2

a first inverting step configured to form an N-type region including a center position in a depth direction of a semiconductor substrate by implanting a donor into the P-type semiconductor substrate and heat treatment

Methodology Applied
Scientific EffectDiffusion: Diffusion

Data Source

PatentUS12349376B1Semiconductor device and manufacturing method of semiconductor device
Publication Date: 2025.07.01 FUJI ELECTRIC CO LTD
  • US12349376B1 patent drawing
  • US12349376B1 patent drawing
  • US12349376B1 patent drawing

AI summary

Provided is a semiconductor device including a semiconductor substrate having an upper surface, a lower surface, and a center position equidistant from the upper surface and the lower surface in a depth direction of the semiconductor substrate. One or more N-type regions with an N-type conductivity are provided in the semiconductor substrate such that at least one N-type region among the one or more N-type regions includes the center position of the semiconductor substrate. An entire portion of the semiconductor substrate includes a bulk-acceptor having a bulk-acceptor concentration. A carrier concentration in all of the one or more N-type regions is higher than the bulk-acceptor concentration.